RF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4
Brand Name:Bicheng Enterprise
Certification:UL
Model Number:BIC-0074-V1.20
Minimum Order Quantity:1
Delivery Time:10 working days
Payment Terms:T/T, Western Union
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Supplier`s last login times:
within 1 hours
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Product Details
RF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4
(PCB’s are custom-made products, the picture and parameters shown are just for reference)
Hello everyone,
Warm greetings!
Today we’ll see a type of 4 layer hybrid PCB built on 0.203mm (8mil) RO4003C and FR-4 for the application of attenuator. It's 1.1 mm thick with blue solder mask and immersion silver on pads. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
Let’s see the stack-up.
Layer 1 to layer 2 is the RO4003C core, then the left are FR-4 material. Boards are through holes.
Let’s see the micro-section.
Features and Benefits
1) RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.
2) Signal integrity performance improvement over the stack-ups with all FR4 board
3) Thermal stress test, reliability test, insulation resistance test and ionic contamination test, AOI test etc.
4) No MOQ
5) Experienced sales persons provide skilled customer services.
Applications
RF transceiver Power divider LNB Attenuator Directional coupler Photocoupler
Parameter and Data Sheet
| PCB SIZE | 140 x 35 mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 4 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um TOP layer |
| RO4003C 0.203mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.5mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| FR-4 0.2mm | |
| copper ------- 35um BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 7.8 mil / 4.4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 2.5 mm |
| Number of Different Holes: | 4 |
| Number of Drill Holes: | 91 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | Rogers RO4003C +FR4 hybrid material |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.1 mm ±0.11 |
| PLATING AND COATING | |
| Surface Finish | Immersion silver |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Blue, KSM-6189BL04/KSM-19H01 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | NO |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
RF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4
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