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Rogers RT/duroid 6006 High Frequency PCB on 25mil, 50mil and 75mil Coating Immersion
Gold and Green Mask for Ground Radar Warning
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
Hi Guys,
Today we’re going to talk about Rogers 6006 PCB.
Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE
composites which are designed for electronic and microwave circuit
applications requiring a high dielectric constant. RT/duroid 6006
laminate is available with a dielectric constant value of 6.15.
PCB Capability (RT/duroid 6006)
PCB Material: | Ceramic-PTFE composite |
Designator: | RT/duroid 6006 |
Dielectric constant: | 6.15 ±0.15 (process) |
6.45 (design) | |
Layer count: | 1 Layer, 2 Layer |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 25mil (0.635mm) |
50mil (1.27mm), 75mil (1.90mm) | |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion Tin, Immersion Silver and OSP. |
RT/duroid 6006 microwave laminates feature ease of fabrication and
stability in use. This property results in the possibility of mass
production and reducing the cost of goods. It has tight dielectric
constant and thickness control, low moisture absorption, and good
thermal mechanical stability.
Features and Benefits
1. High dielectric constant for circuit size reduction |
2. Low loss. Ideal for operating at X-bank or below |
3. Tight DK and thickness control for repeatable circuit performance |
The typical applications are aircraft collision avoidance systems,
ground radar warning systems, patch antennas, satellite
communications systems etc.
Thank you for your reading.
Appendix: Properties of RT/duroid 6006 laminates.
RT/duroid 6006 Typical Value | |||||
Property | RT/duroid 6006 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 7 x 107 | Mohm.cm | A | IPC 2.5.17.1 | |
Surface Resistivity | 2 x 107 | Mohm | A | IPC 2.5.17.1 | |
Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |
Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |
Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |
Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |
Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |
Ultimate Strain | 33 | Z | % | ||
Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |
Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |
Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
Moisture Absorption | 0.05 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |
Coefficient of Thermal Expansion | 47 34 117 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | ℃ TGA | ASTM D3850 | ||
Density | 2.7 | g/cm3 | ASTM D792 | ||
Specific Heat | 0.97(0.231) | j/g/k (BTU/ib/OF) | Calculated | ||
Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |