Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

General description
This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of PLC Automation.

Basic specifications
Base material: Polyimide 25μm + polyimide stiffener +3M sticker
Layer count: 2 layers
Type: Individual FPC
Format: 93mm x 44mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 0 μm
Solder mask / Legend: Yellow coverlay / No.
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months



Features and benefits
Reliability increased;
Controllability of electrical parameter design;
Good oxidation resistance and good heat dissipation;
Powerful PCB capabilities support your research and development, sales and marketing;
Delivery on time higher than 98% on-time-delivery rate;
Quick CADCAM checking and free PCB quotation;
8000 types of PCB's per month;

Applications
industrial control touch remote control soft board, Tablet PC module soft board, mobile phone module flex board, Consumer electrostatic Bracelet soft board, capacitive touch screen / panel, medical equipment controller

Flexible Printed Circuit (FPC) Capability 2021

Components of a flexible circuit
A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
Copper foil is available in two different types of copper: ED Copper and RA copper.

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.
Copper foil is available in thickness of 12, 18, 35 and 70 μm.

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:
High temperature resistance allows soldering operations without damaging the flexible circuits
Very good electrical properties
Good chemical resistance
Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.