Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

Brand Name:Bicheng Technologies Limited
Certification:UL
Model Number:BIC-0057-V2.8
Minimum Order Quantity:1
Delivery Time:4-5 working days
Payment Terms:T/T, Paypal
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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Product Details

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.



Typical applications:

1. Automotive collision avoidance systems

2. Automotive global positions satellite antennas

3. Base station infrastructure

4. Datalink on cable systems

5. Direct broadcast satellites

6. LMDS and wireless broadband

7. Microstrip patch antennas

8. Power backplanes

9. Remote meter readers

10. Wireless telecommunications systems


PCB Specifications

PCB SIZE102 x 102mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 18µm(0.5 oz)+plate TOP layer
RO3210 1.270mm
copper ------- 18µm(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:6 mil / 4 mil
Minimum / Maximum Holes:0.4 mm / 2.5 mm
Number of Different Holes:8
Number of Drill Holes:32
Number of Milled Slots:0
Number of Internal Cutouts:NO
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:RO3210 1.270mm
Final foil external:1 oz
Final foil internal:1 oz
Final height of PCB:1.3 mm ±10%
PLATING AND COATING
Surface FinishImmersion gold
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAPlated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


Data Sheet of Rogers 3210 (RO3210)

RO3210 Typical Value
PropertyRO3210DirectionUnitsConditionTest Method
Dielectric Constant,εProcess10.2±0.5Z10 GHz 23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign10.8Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0027Z10 GHz 23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-459Zppm/℃10 GHz 0℃to 100℃IPC-TM-650 2.5.5.5
Dimensional Stability0.8X, Ymm/mCOND AASTM D257
Volume Resistivity103MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity103COND AIPC 2.5.17.1
Tensile Modulus579
517
MD
CMD
kpsi23℃ASTM D 638
Water Absorption<0.1-%D24/23IPC-TM-650 2.6.2.1
Specific Heat0.79j/g/kCalculated
Thermal Conductivity0.81W/M/K80℃ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
X,Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500TGAASTM D3850
Density3gm/cm3
Copper Peel Stength11pli1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes
China Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas supplier

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

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