High Frequency PCB Rogers 10mil 0.254mm RO4350B PCB Double Sided RF PCB for LTE

Brand Name:Bicheng Technologies Limited
Certification:UL
Model Number:BIC-004-V3.6
Minimum Order Quantity:1
Delivery Time:4-5 working days
Payment Terms:T/T, Paypal
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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Product Details

High Frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB for LTE

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RO4350B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.



The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.


PCB Specifications

PCB SIZE30 x 80mm=1up
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
RO4350B 0.254mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:N/A
Minimum / Maximum Holes:N/A
Number of Different Holes:N/A
Number of Drill Holes:0
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:RO4350B Tg280, er<3.48, Rogers Corp.
Final foil external:1.5 oz
Final foil internal:N/A
Final height of PCB:0.3 mm ±0.1
PLATING AND COATING
Surface FinishImmersion gold, 16%
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIANO
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID



Data Sheet of Rogers 4350B (RO4350B)

RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280 TMAAIPC-TM-650 2.4.24.3
Td390 TGAASTM D 3850
Thermal Conductivity0.69W/M/oK80ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.86gm/cm323ASTM D 792
Copper Peel Stength0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0UL 94
Lead-free Process CompatibleYes

China High Frequency PCB Rogers 10mil 0.254mm RO4350B PCB Double Sided RF PCB for LTE supplier

High Frequency PCB Rogers 10mil 0.254mm RO4350B PCB Double Sided RF PCB for LTE

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