SMT Assembly Solder Paste Stencil | PCB Stencil with aluminum frame 420 mm x 520 mm |0.12mm-1.0mm foil
Brand Name:Bicheng Enterprise Limited
Certification:UL
Model Number:BIC-0363-V3.63
Minimum Order Quantity:1
Delivery Time:2-3 working days
Payment Terms:T/T/Paypal
Contact Now
Add to Cart
Site Member
Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
Product profile
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built
on 0.1mm stainless
steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error
rate;
B. The opening position accuracy of SMT template is very high: the
whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is
advantageous to
the printing and forming of tin paste;
D. Engineering design prevents problems from occurring in pre
production;
E. Team with passion, discipline, responsibility and honesty;
F. Door to door shipment service;
G. More than 15 years of experience;
H. Hassle-free, one-to-one after-sales service;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
| Dimension: | 370mm x 470mm, 420mm x 520mm, 550mm x 650mm | |||||
| Structure | Stencil foils with aluminum frame | |||||
| Base material | Stainless steel shim | |||||
| Foil Thickness | 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm | |||||
| Aperture configured | Laser cut | |||||
| Appearance | Engraving and electro polishing | |||||
| Fiducial mark | Through hole | |||||
| Service area: | Worldwide | |||||
| Quantity of open pads: | 1421 | |||||
| Advantages: | a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. | |||||
| Application: | CSP, BGA, 0.5mm QFP etc. package | |||||
1.5 Opening Hole Design for Stencil
Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
| PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
| QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
| QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
| QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
| QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
| 0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
| 0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
| BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
| BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
| BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
| Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
| Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
The main PCBs
SMT Assembly Solder Paste Stencil | PCB Stencil with aluminum frame 420 mm x 520 mm |0.12mm-1.0mm foil
Inquiry Cart
0