9508H One-Component Heat-Curing Type TC >8.0 W/M·K Excellent Workability Low Static / Transient Stress On Substrates

Brand Name:HUITIAN
Certification:RoHS
Model Number:9508H
Minimum Order Quantity:180 kg
Delivery Time:5-8 days
Payment Terms:L/C, T/T
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Location: Shanghai Shanghai
Address: No. 251, Wenji Road, Songjiang District, Shanghai China
Supplier`s last login times: within 1 hours
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Product Details

9508H is one-component Heat-curing type; TC >8.0 W/M·K; Excellent workability and Low static/transient stress on substrates



Product Description


  • Light green gel
  • One-component heat-curing type
  • Silicone thermal conductive composite

Product Features:


  • High thermal conductivity >8W/m∙K
  • Excellent workability
  • Low static/transient stress on substrates
  • High reliability under various conditions
  • 9508H can be stored for a long time at low temperatures, has a long operating time at room temperature and can be cured quickly at high temperatures


Technical Parameters


StandardPropertyUnitResult
Component-One
VisualColor-Light green
Flow rateg/min120
ASTM D792Densityg/mL3.3
Bond line thicknessmm0.28
-Operational time @25℃d>60
-Curing time @150min30
ASTM D5470Thermal conductivityW/(m·K)>8.0
ISO22007-2Thermal conductivityW/(m·K)>10.0
ASTM D5470Thermal Impedance

℃·cm2/W

0.38
ASTM D257Volume resistivityΩ·cm>1.0x1012
ASTM D149Dielectric strengthkV/mm>5
UL94Flame retardant grade-V0
-Working temperature-40─150

Main Applications:

  • Automotive electronic equipment
  • Mobile electronics
  • Communication base station
  • Graphics card
  • Microprocessors and chips

Packing:

30cc/tube; 300cc/tube


Storage:

Store below 35°C in a cool and dry place.

Shelf life is 6 months.

9508H One-Component Heat-Curing Type TC >8.0 W/M·K  Excellent Workability Low Static / Transient Stress On Substrates
China 9508H One-Component Heat-Curing Type TC >8.0 W/M·K  Excellent Workability Low Static / Transient Stress On Substrates supplier

9508H One-Component Heat-Curing Type TC >8.0 W/M·K Excellent Workability Low Static / Transient Stress On Substrates

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