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Model | KTE-1000 |
Machine parameter | |
Dimension(L × W × H) | 6135*1360*1490 |
Color | Computer grey |
Weight | Approx 2615kg |
Number of heating zone | Top 10/Bottom 10 |
Length of heating zone | 3892mm |
Number of cooling zone | UP2 cooling air conversion |
Rectifying plate structure | Galvanized sheet |
Exhaust volume requiement | 10m³/min*2(Exhausts) |
Control system | |
Power supply requiement | 3 phase ,380v 50/60HZ(Option:3 phase ,220v 50/60HZ |
Total power | 80KW |
Startup power | 36KW |
Normal power consumption | 11KW |
Warming Time | Approx:30min |
Temperature control range | Room Temperature -300℃ |
Temperature control method | PID close loop control + SSR driving |
Temperature control precision | ±1℃ |
Temperature deviation on PCB | ±1.5℃(by RM board test standard) |
Data storage | Process data and status storage |
Abnormal alarm | Abnormal temperature(extra-high/extra low temperature ) |
Color tower | Tower light(yellow-warning;green normal;red -Abnormal |
Conveyor system | |
Max width of PCB | 400mm(option:450mm) |
Conveyor direction | L→R(option:R→L) |
Fixed rail side | Front rail fixed(option: Rear rail fixed) |
PCB transmisson agent | Chain+mesh |
PCB Top height | Top 30mm/Bottom 25mm |
Conveyor height | 900±20mm |
Conveyor speed | 300-2000mm/min |
Option | |
Dual-rail converyor | Dual line with”D”,rail 1.3 or 1.4 fixed ,Max PCB is 250*250mm |
SMT Reflow Oven / SMT Reflow Furnace (S8)
Main product : reflow furnace,reflow oven,smt reflow oven,smt mounter,Smt Pick and Place Machine,Smt Placement Machine,Smt Mounting Machine,Elctronic Equipment,Pcb Machine,Reflow Oven,Electronic Equipment,Smt Assembly,Smt/Smd Equipment.
1, Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2, The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3, Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4, Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5, To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6, Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec. )
7, Center support and dual rail is optional.