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Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass

Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass

Brand Name:HT
Certification:ISO9001:2015&ISO16949
Model Number:HT-RB
Minimum Order Quantity:2
Delivery Time:2-3weeks
Payment Terms:T/C,T/T
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Location: Zhengzhou Henan China
Address: 176#, The 7th Street, Economic & Technological Development Area. 450016, Zhengzhou, China
Supplier`s last login times: within 15 hours
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Product Details

Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips

Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.

Features:

1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.

2. Resin bonds are extremely flexible, therefore improving the surface finish quality.

Applications:

This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.

Specifications


Technical Parameters

O.DThicknessI.D
SizeToleranceSizeStandard toleranceHigh precision toleranceSizeTolerance
50~ 100+0.020.1~≤ 0.15±0.00525.4
30
31.75
40
60
80
88.9
+0.02~ 0

China Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass supplier

Tolerance +0.02~ 0 Dicing Saw Blade Durable For Cutting Brittle Quartz Glass

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