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PE Anti-static Electronic Component Packaging Bag Mesh Bag Electronic Component Packaging Bag
this PE anti-static conductive mesh bag is a packaging solution that combines physical structure (mesh) and chemical materials (conductive/anti-static agents) to achieve efficient electrostatic protection. It combines protection, durability, breathability, and visibility, and is a key protective material that ensures high-value, high-sensitivity electronic products are protected from electrostatic damage throughout the entire supply chain.
Product Name | PE ESD Anti-Static Mesh Bag |
Material Structure | PE |
Surface resistance | 10e6 - 10e8 ohms |
Style | Open End,Mesh Printing |
Size and Printing | 30.5*40.7cm;18*436cm;30.5*30.5cm or customized, Printing as customer request |
Application | electronic product packaging |
Surface Handling | Screen Printing |
Color | black,Mesh Printing |
Logo | Logo can be customized |
Color: The most common is black grid semi transparent.
Structure: Its uniqueness lies in that it is a mesh bag. The bag
body is not a completely sealed film, but is made of PE material in
a grid shape (usually a lattice or diamond grid shape), which
increases the flexibility and tear resistance of the material.
Detailed explanation of core functions
Each keyword in the name corresponds to its key characteristic:
Anti Static/Conductive
This is the core function of the product. The inside of the bag is
embedded with special conductive carbon black or permanent
anti-static chemical material, which keeps its surface resistivity
within a range that can safely dissipate charges (usually between
10 ^ 4~10 ^ 11 Ω/sq).
Working principle: When sensitive electronic components (such as IC
chips and circuit boards) are placed in a bag, the bag forms a
Faraday Cage effect to protect the environment. This means that the
external electrostatic field cannot penetrate into the inside of
the bag, and the static charges generated inside can also be safely
exported and dissipated through the conductive grid, thereby
avoiding electrostatic discharge (ESD) breakdown and damage to
precision electronic components.
Mesh Bag
Unlike fully sealed shielding bags, the mesh design provides
breathability. This is very useful in certain processes, such as
reflow soldering or wave soldering, where the bag can be placed in
an oven along with the components, and the hot air can be evenly
heated through the grid, avoiding the bag from bursting due to
internal air expansion caused by heat. At the same time, it is also
easy to evaporate moisture after cleaning.
Packaging Bag for Electronic Components/Motherboard Bag
Clear purpose: designed specifically for packaging, transportation,
and storage of electronic products that are sensitive to static
electricity.
Diverse sizes: There are multiple sizes to choose from, ranging
from small bags for packaging integrated circuit (IC) chips to
large bags large enough to accommodate the entire computer
motherboard, graphics card, hard drive, or industrial control
board.
Main advantages and characteristics
1. Excellent ESD protection: Provides bidirectional electrostatic
shielding inside and outside, effectively preventing the
generation, accumulation, and discharge of static electricity.
2. Durable and tear resistant: The mesh structure enhances the
mechanical strength of the bag, making it more resistant to tearing
and punctures than ordinary plastic film.
3. Physical protection: The soft PE material can cushion minor
impacts and prevent component pins from bending or surface
scratches.
4. Visibility: The semi transparent feature allows for easy
identification of the contents without opening the bag,
facilitating inventory management and retrieval.
5. Reusable: With good durability, as long as there is no damage,
it can be opened and sealed multiple times (usually with self
sealing strips or can be sealed with anti-static tape), economical
and environmentally friendly.
Application scenarios
This bag is a must-have for the electronics manufacturing, repair,
and storage industries, commonly used for:
PCB board: Packaging, transportation, and storage of computer
motherboards, graphics cards, memory modules, etc.
IC chip: Packaging various integrated circuits.
Hard disk drive (HDD), solid state drive (SSD).
Network equipment: such as routers, boards inside switches.
Automotive electronic module.
Factory production line: temporarily storing and transferring
sensitive components during the manufacturing process.
Applications:
● Electronic Product Packaging.
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