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Ultrasonic AEM Spraying Technology
Description:
Ultrasonic AEM spraying is a high-precision, low waste spraying
technological know-how appropriate for non-contact machining
processes. Ultrasonic AEM spraying generates extraordinarily small
droplets via ultrasonic vibration, accomplishing micrometer or even
nanometer stage coating thickness control, making sure excessive
uniformity and accuracy of the coating.
Ultrasonic AEM spraying is appropriate for liquid substances of a
variety of viscosities, which include excessive viscosity
materials, as properly as unstable or warmness touchy materials.
During the processing, direct contact between the nozzle and the
substrate is avoided, lowering the threat of substrate damage. It
is appropriate for flexible, fragile, or irregularly formed
substrates.
Parameters:
Product Type | Intelligent Ultrasonic Precision Coating Machine desktop Type |
Spray Nozzle Operating Frequency | 20-200KHz (Normally use 60100110120K) |
Nozzle Power | 1-15W |
Continuous Spraying Volume Max | 0.01-50ml/min |
Effective Spraying Width | 2-100mm |
Spray Uniformity | ≥95% |
Solution Conversion Rate | ≥95% |
Dry Film Thickness | 20nm-100μm |
Solution Viscosity | ≤30cps |
Temperature Range | 1-60℃ |
Atomized Particles (Median Value) | 10-45μm (distilled water), determined by the frequency of the nozzle |
Diversion Pressure Max | ≤0.15MPA |
Input Voltage | 220V±10%/50-60Hz |
Exercise Mode | XYZ three-axis, independently programmable |
Control Mode | FUNSONIC spraying control system, PLC control, 13.3-inch full-color touch screen |
Control Content | Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems |
Liquid Supply Method | Precision injection pump |
Ultrasonic Dispersion System (Optional) | 20ml or 50ml, 40K, biological grade sampler |
Rated Power of Ultrasonic Dispersion System | 100W |
Substrate Type:
1. Glass
Suitable for manufacturing transparent conductive films, widely
used in touch screens and optoelectronic devices.
2. Ceramics
In the field of electronic components and catalysts, ceramic
substrates can provide good chemical stability and high temperature
resistance.
3. Metal
Metal substrates such as aluminum, copper, etc. can be used for
electrical connections and deposition of conductive films.
4. Semiconductors
Semiconductor materials such as silicon and germanium are suitable
for thin film deposition in microelectronic devices to ensure
excellent electrical performance.
5. Polymer
Some polymer substrates can withstand low-temperature deposition
and are suitable for the preparation of flexible electronic
devices.
6. Composite materials
Composite substrates can be used for purposes that require
light-weight and excessive strength, such as the aerospace and
automobile industries.
7. Thin film materials
Suitable for surface modification and functionalization of other
existing thin film materials.
8. Optical materials
Optical materials with good transparency can be used for the
deposition of optical thin films, improving transparency and anti
reflection performance.
9. Biomaterials
Suitable for deposition of biocompatible coatings in biomedical
applications.
Scientific Research Laboratory Qualitative Testing Ultrasonic
Coating Machine