Ultrasonic Semiconductor Wafer Coating Continuous

Brand Name:FUNSONIC
Certification:CE
Model Number:FS620
Minimum Order Quantity:1 UNIT
Payment Terms:T/T, Western Union
Place of Origin:CHINA
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Location: Hangzhou Zhejiang China
Address: No. 196 Shitashang Qiufeng Village, Fuchun Subdistrict, Fuyang District, Hangzhou City, Zhejiang Province, China. 311400
Supplier`s last login times: within 48 hours
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Product Details

Ultrasonic Semiconductor Wafer Coating



Description:


Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer cutting, chip connections are achieved through heating and pressure to produce consistent adhesive lines and small, controlled corners.

Ultrasonic semiconductor wafer coating technology needs to consider spraying parameters during use, such as ultrasonic frequency, spraying speed, and coating thickness, which need to be optimized according to specific materials and requirements; At the same time, material properties can also have a certain impact on the spraying effect, such as the viscosity, surface tension, and volatility of the coating, which need to be considered when selecting materials.



Parameters:


Product TypeIntelligent Ultrasonic Precision Coating Machine desktop Type FS620
Spray Nozzle Operating Frequency20-200Khz
Nozzle Power1-15W
Continuous Spraying Volume Max0.5-10ml/min
Effective Spraying Width2-20mm
Spray Uniformity≥95%
Solution Conversion Rate≥95%
Dry Film Thickness20nm-100μm
Solution Viscosity≤30cps
Temperature Range1-60℃
Atomized Particles (Median Value)15-40μm (distilled water), determined by the frequency of the nozzle
Diversion Pressure Max≤0.05MPA
Input Voltage220V±10%/50-60Hz
Exercise ModeXYZ three-axis, independently programmable
Control ModeFUNSONIC spraying control system, PLC control, 13.3-inch full-color touch screen
Control ContentUltrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems
Liquid Supply MethodPrecision injection pump
Ultrasonic Dispersion System (Optional)20ml or 50ml, 40K, biological grade sampler
Rated Power of Ultrasonic Dispersion System100W


Application :


1. Coating of photosensitive layer:
In photolithography, ultrasonic technology is used to uniformly coat photosensitive materials, ensuring high-resolution pattern transfer.
2. Protective coating:
Apply anti-corrosion and scratch resistant protective coatings to enhance the durability of the wafer.
3. Functional coating:
In certain applications, functional materials with specific electrical or optical properties can be coated.






Ultrasonic Semiconductor Wafer Coating



China Ultrasonic Semiconductor Wafer Coating Continuous supplier

Ultrasonic Semiconductor Wafer Coating Continuous

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