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Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices

Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices

Brand Name:JBNR
Certification:ISO9001
Model Number:HCMC016
Minimum Order Quantity:10 pcs
Delivery Time:20 days
Payment Terms:L/C, D/A, D/P, T/T, Western Union
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Location: Zhuzhou Hunan China
Address: No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.
Supplier`s last login times: within 1 hours
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Product Details

Molybdenum Copper Carrier With Lower Thermal Conductivity And A Wider CTE Range For GaN Devices


Description:

Molybdenum copper heat sink is one of the heat spreader materials.

It has been frequently chosen by engineers for its cost and quality ratio. It has good thermal conductivity and wide thermal expansion.

Compared with other materials, it has good machineability.

We can offer 85MoCu to 50MoCu sheets, machined parts, or stamped parts, wire cutting parts.

And based on different application, we can offer plating based on your requirements. After plating, we will ensure your have a good welding condition.


Product Properties:


GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu85±2%10.017200(25℃)/156(100℃)
80MoCu80±2%9.97170(25℃)/190(100℃)
70MoCu70±2%9.87.3200(25℃)/196(100℃)
60MoCu60±2%9.668.4222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)


Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product Tags:
China Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices supplier

Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices

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