Home /Construction Tools /

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

Brand Name:JBNR
Model Number:50MoCu,60MoCu,70MoCu,85MoCu
Minimum Order Quantity:Negotiation
Delivery Time:15days
Payment Terms:L/C, , T/T, Western Union
Place of Origin:CHINA
Contact Now

Add to Cart

Verified Supplier
Location: Zhuzhou Hunan China
Address: No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.
Supplier`s last login times: within 1 hours
Shipping
lt's easy to get a shipping quote! Just click the button below and complete the short form.
Get Shipping Quote
Product Details Company Profile
Product Details

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION


Description:


Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


Advantages:


1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


Product Properties:


GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu85±2%10.07160(25℃)/156(100℃)
70MoCu70±2%9.87200(25℃)/196(100℃)
60MoCu60±2%9.667.5222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

Application:


This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


Product picture:

China MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION supplier

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

Inquiry Cart 0