1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIF100-12-05ES
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Verified Supplier
Location: Dongguan Guangdong China
Address: No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times: within 2 hours
Product Details Company Profile
Product Details

1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Products description


The TIF®100-12-05ES Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive. They are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. Its smooth, puncture-, tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.


Features


> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Broad range of hardnesses available
> Moldability for complex parts


Applications


> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

> Mass storage devices
> Automotive electronics
> Set top boxes


Typical Properties of TIF®100-12-05ES Series
ColorBlueVisual
Construction & CompostionCeramic filled silicone elastomer******
Thickness range0.020"(0.5mm)~0.200"(5.0mm)ASTM D374
Specific Gravity2.0g/ccASTM D297
Hardness12±5 Shore 00ASTM 2240
Operating Temp-40 ~ 160℃******
Dielectric Breakdown Voltage≥5500 VACASTM D149
Dielectric Constant @1MHz4.5MHzASTM D150
Volume Resistivity≥1.0X1012 Ohm-cmASTM D257
Fire rating94 V0UL E331100
Thermal conductivity1.2 W/m-KASTM D5470

Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)


Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team


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A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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China 1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad supplier

1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

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