High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink

Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIS805-16-03
Minimum Order Quantity:1000pcs
Delivery Time:3-6 work days
Place of Origin:China
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Verified Supplier
Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times: within 2 hours
Product Details Company Profile
Product Details

High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


The TIS®805-16-03 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.


Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures

> Easy release construction
> Electrically isolating
> High durability


Applications:
> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

Typical Properties of TIS®805-16-03 Series
PropertyValueTest Method
ColorYellowVisual
Construction &CompostionCeramic filled silicone elastomer /Polyimide film******
Thickness range

0.005inch (0.127mm)

ASTM D374
Tensile Strength(MPa)12ASTM D412
Density2.4 g/ccASTM D297
Continuos Use Temp-60 to 180℃******
Breakdown Voltage(V/mm)3000ASTM D149
Dielectric Constant @ 1MHz

6.0

ASTM D150
Volume Resistivity1.0X1012 Ohm-meterASTM D257
Fire rating94 V0UL94(E331100)
Thermal conductivity1.6W/m-KASTM D5470
Thermal impedance(℃-in²/W)@30psi0.5ASTM D5470

Standard Thicknesses

0.005inch (0.127mm)


Standard Sizes
12" x 160"(304mm * 48.76M)

The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.

Packaging Details & Lead time


1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

China High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink supplier

High Temperature Resistance Silicone Heating Thermal Conductive Insulation For Gpu Cpu Heatsink

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