5.0W High Thermal Conductive Phase Change Silicone Pad Sheet For Laptop CPU GPU
Brand Name:Ziitek
Certification:RoHS
Model Number:TIC810G
Minimum Order Quantity:1000pcs
Delivery Time:3-6 work days
Payment Terms:T/T
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
5.0W High Thermal Conductive Phase Change Silicone Pad Sheet For Laptop CPU GPU
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operating temperatures.
Features
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
| Typical Properties of TICTM800G Series | |||||
| Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005" | 0.008" | 0.010" | 0.012" | ***** |
| (0.126mm) | (0.203mm) | (0.254mm) | (0.305mm) | ||
| Thickness Tolerance | ±0.0005'' | ±0.0008'' | ±0.0010'' | ±0.0012'' | ***** |
| (±0.127mm) | (±0.203mm) | (±0.0254mm) | (±0.0305mm) | ||
| Density | 2.6g/cc | Helium Pycnometer | |||
| Temperature range | -40℃～125℃ | ***** | |||
| Phase Change Softening Temperature | 50℃~60℃ | ***** | |||
| Thermal Conductivity | 5.0 W/mK | ISO22007-2 | |||
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.024℃-in²/W | 0.028℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.15℃-cm²/W | 0.18℃-cm²/W | ||
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400"(406mm x 121.92M)
TIC™800G series are supplied with a white release paper and a
bottom liner. TIC™800G series is available in kiss cut an extended
pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800G series
products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
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5.0W High Thermal Conductive Phase Change Silicone Pad Sheet For Laptop CPU GPU
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