Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry
Brand Name:Ziitek
Certification:RoHS
Model Number:TS-TIR700-25
Minimum Order Quantity:1000pcs
Delivery Time:3-8 work days
Payment Terms:T/T
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Works Under Low Pressure Carbon Fibre Based Thermal Pad For
Optoelectronics industry
Company profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Products introduction
TS-TIR®700-25 Series series is a high-performance carbon-based thermal pad that
combines highly thermally conductive carbon fiber with polymer
silicone materials. Utilizing advanced manufacturing processes to
precisely distribute thermal pathways, it achievese xceptional
thermal conductivity, effectively reducing interfacial thermal
resistance and enhancing heat dissipation efficiency. With its
ultra-thin, lightweight design and mechanical flexibility, it is
suitable for 5G equipment, high-performance chips, and other high
heat flux applications.
Feature
>Good thermal conductivity 25w/mK
>Ultra-low thermal resistance
>works under low pressure.
>Non-insulating material with electrical conductivity
>Non-adhesive surface
Application
>Between chips and heat dissipation modules
>5G communication equipment
>Optoelectronics industry
>wearable devices
| Typical Properties of TIR®700-25 series | |||
| Product Name | TIR®700-25 | Test Method | |
| Colour | Gray | Visual | |
| Construction | Carbon fiber filled silicone | ***** | |
| Thickness range | 0.01"~0.04" (0.3~1.0 mm) | 0.06"~0.20"(1.5~5.0 mm) | ASTM D374 |
| Hardness | 75±10 Shore 00 | 55±10 Shore 00 | ASTM D2240 |
| Density | 2.9g/cm3 | ASTM D792 | |
| Operation Temperature | -40℃~ 200℃ | ****** | |
| Thermal impedance | 25.0W/m-K | ASTM D5470 | |
| Specific heat capacity (J/g ℃) | 0.75 | ASTM E1269 @25℃ | |
| Flame Rating | V-0 | UL94 | |
| RoHS | Compliant | IEC62321 | |
Product Specification
Standard Thickness:0.01" (0.3mm), 0.02"(0.5mm), 0.04"(1.0mm), 0.06"
(1.5mm), 0.08" (2.0mm), 0.10" (2.5mm), 0.12" (3.0mm)
Standard Size: 1.97"×1.97"(50.0mm x 50.0mm)
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
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Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry
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