Wholesale 2.5W/mK Thermal Conductivity Phase Change Material for CPU Cooling
Brand Name:Ziitek
Certification:RoHS
Model Number:TIC810A series
Minimum Order Quantity:1000pcs
Delivery Time:3-6 work days
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
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Product Details
Wholesale 2.5W/mK Thermal Conductivity Phase Change Material for CPU Cooling
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
The TIC®800A series is a high-performance,cost-effective thermal interface material featuring a unique grain-oriented structure that enables precise conformity to device surfaces, thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°C, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface, significantly improving heat dissipation performance.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV,Lighting
> Laptop computer
| Typical Properties of TIC®800A Series | ||||||
| Product Name | TIC®805A | TIC®806A | TIC®808A | TIC®810A | TIC®820A | Testing standards |
| Color | Gray | Visual | ||||
| Composite Thickness | 0.005" | 0.006" | 0.008" | 0.010" | 0.020" | ASTM D374 |
| (0.127mm) | (0.152mm) | (0.203mm) | (0.254mm) | (0.508mm) | ||
| Density | 2.5g/cc | ASTM D792 | ||||
| Work temperature | -40℃～125℃ | Ziitek Test Method | ||||
| phase transition temperature | 50℃~60℃ | Ziitek Test Method | ||||
| Thermal conductivity | 2.5 W/mK | ASTM D5470 | ||||
| Thermal lmpedance(℃-in²/W) @ 50 psi | 0.055 | 0.06 | 0.062 | 0.074 | 0.095 | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127 mm),0.006"(0.152 mm),0.008"(0.203 mm),0.010" (0.254 mm),0.020"(0.508 mm)
For other thickness options, please contact us.
Standard size: 10”x 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800A series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull
tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive: Not applicable to TIC®800A series products.Reinforcement Materal: No reinforcement
materialrequired.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory
solution.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Wholesale 2.5W/mK Thermal Conductivity Phase Change Material for CPU Cooling
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