Wholesale Thermally Conductive Gel For Heat Sink Any Heat Generating Semiconductor
Brand Name:Ziitek
Certification:UL
Model Number:TIF030AB-05S Thermally Conductive Gel
Minimum Order Quantity:1000 pcs
Delivery Time:3-8 work days
Payment Terms:T/T
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Wholesale Thermally Conductive Gel For Heat sink any Heat Generating Semiconductor
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Ziitek TIF030AB-05S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.
< Good thermal conductive: 3.0W/mK
< UL recognized
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing
Applications
< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor
| Typical Properties of TIF030AB-05S Series | |||
| Uncured Material Properties | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Blue | Visual | |
| Part A Viscosity (mPa.s) | 900,000 cps | GB/T 10247 | |
| Part B Viscosity (mPa.s) | 1,500,000 cps | GB/T 10247 | |
| Flow Rate (g/min) | 25 | Ziitek Test Method | |
| Density | 3.1g/cc | ASTM D297 | |
| Bond Line thickness (mm) | 0.2 | Ziitek Test Method | |
| Thermal resistance @10psi(℃•in2/W) | 0.75 | ASTM D5470 | |
| Thermal resistance @50psi(℃•in2/W) | 0.45 | ASTM D5470 | |
| Mix Ratio | 0.042361111 | ****** | |
| Shelf Life | 12 months | ****** | |
| Cure Schedule | |||
| Pot Life @25℃ | 30min | Ziitek Test Method | |
| Cure @25℃ | 16hrs | Ziitek Test Method | |
| Cure @70℃ | 30min | Ziitek Test Method | |
| Cure Material Properties | |||
| Color | Blue | Visual | |
| Hardness | 65 shore00 | ASTM D2240 | |
| Continuous Use Temp | -45~200℃ | Ziitek Test Method | |
| Break Voltage | ≥5500 | ASTM D149 | |
| Flame Rating | 94V0 | UL E331100 | |
| Thermal Conductivity | 3.0W/Mk | ASTM D5470 | |
Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing
applications. Please contact us for confirming.
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Wholesale Thermally Conductive Gel For Heat Sink Any Heat Generating Semiconductor
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