Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules
Brand Name:Ziitek
Certification:UL
Model Number:TIF1120-30-02US thermal pad
Minimum Order Quantity:1000 pcs
Delivery Time:3-8 work days
Payment Terms:T/T
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules
Company Profile
With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
TIF100-30-02US-Datasheet-REV02.pdf
Ziitek TIF1120-30-02US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
<Good thermal conductive:3.0W/mK
<Thickness:3.0mmT
<Hardness:20 Shore 00
<Colour: gray
<RoHS compliant
<UL recognized
<Easy release construction
Applications
<mainboard/mother board
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
Typical Properties of TIF1120-30-02US | |||
Product Name | TIF1120-30-02US Series | ||
Colour | Gray | ||
Construction & Compostion | Ceramic filled silicone elastomer | ||
Specific gravity | 2.9 g/cc | ||
Thickness | 3.0mmT | ||
Hardness | 20 Shore 00 | ||
Dielectric constant@1MHz | 3.8 MHz | ||
Continuos Use Temp | -40 to 160℃ | ||
Dielectric Breakdown Voltage | >5500 VAC | ||
Thermal conductivity | 3.0 W/mK | ||
| Volume Resistivity | 1.0*1012 Ohm-cm | ||
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules
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