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1.5mmT UL Recognized 1.5W/MK thermal Conductive Gap Filler For Electronics 

1.5mmT UL Recognized 1.5W/MK thermal Conductive Gap Filler For Electronics 

Brand Name:Ziitek
Certification:UL
Model Number:TIF160-05ES thermal pad
Minimum Order Quantity:1000 pcs
Delivery Time:3-8 work days
Payment Terms:T/T
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Supplier`s last login times: within 2 hours
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Product Details Company Profile
Product Details

1.5mmT UL recognized 1.5W/MK Self Adhesive Hthermal conductive gap filler for Automotive electronics


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


TIF100-05ES-Datasheet.pdf
The TIF160-05ES is an extremely soft gap filling material rated at a thermal conductivity of 1.5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF160-05ES is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
Features
<Good thermal conductive:1.5 W/mK
<Thickness:1.5mmT
<Hardness:12±5 Shore 00

<RoHS compliant

<UL recognized

<Fiberglass reinforced for puncture, shear and tear resistance

Applications

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

<LED Ceilinglamp

<Monitoring the Power Box

<AD-DC Power Adapters

<Rainproof LED Power


Typical Properties of TIF160-05ES
Product Name
TIF160-05ESSeries
Colour
Blue
Construction & Compostion
Ceramic filled silicone rubber

Density

2.0 g/cm3

Thickness

1.5mmT
Hardness
12±5 Shore 00
Tensile Strength
40 psi
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
1.5 W/mK


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Advantage


Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.


China 1.5mmT UL Recognized 1.5W/MK thermal Conductive Gap Filler For Electronics  supplier

1.5mmT UL Recognized 1.5W/MK thermal Conductive Gap Filler For Electronics 

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