high cost-effective 2.6W/MK CPU Thermal Pad the TIF540US Outstanding thermal performance For mainboard/mother board
Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIF540US Series
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Supplier`s last login times:
within 2 hours
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Product Details
Company Profile
Product Details
high cost-effective 2.6W/MK CPU Thermal Pad the TIF540US Outstanding thermal performance For mainboard/mother board
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
TIF540US Series thermally conductive interface materials are
applied to fill the air gaps between the heating elements and the
heat dissipation fins or the metal base.Their flexibility and
elasticity make them suited to coat very uneven surfaces. Heat can
transmit to the metal housing or dissipation plate from the heating
elements or even the entire PCB, which effecitly enhances the
efficiency and life-time of the heat-generating electronic
components.
Features
> Good thermal conductive: 2.6W/mK
> thickness:1.0mmT
> Moldability for complex parts
> Broad range of hardnesses available
> High tack surface reduces contact resistance
>Broad range of hardnesses available
>Easy release construction
Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Rainproof LED Power
> Telecommunication hardware
> mainboard/mother board
> IT infrastructure
> GPS navigation and other portable devices
>LED Flesible strip, LED bar
Typical Properties of TIF540US Series | ||||
Color | Violet | Visual | Composite Thickness | Thermal Impedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific Gravity | 2.10 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
| Thickness range | 0.040" | ASTM C351 | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 45 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
Dielectric Breakdown Voltage | >10000 VAC | ASTM D412 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Outgassing(TML) | 0.35% | ASTM E595 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.3 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 4.2X1013 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 2.6W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
high cost-effective 2.6W/MK CPU Thermal Pad the TIF540US Outstanding thermal performance For mainboard/mother board
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