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1.5 W/mK Blue LED Thermal Gap Pad Easy With Heat Sink LED Lighting COB CPU GPU
TIF100-05S Datasheet-REV02.pdf
The TIF140--15-5S Series ) is an extremely soft gap filling material rated at a thermal conductivity of 1.5W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF140-15-05S is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
Features
Good thermal conductive:1.5W/m-K |
Moldability for complex parts |
Soft and compressible for low stress applications |
Naturally tacky needing no further adhesive coating |
Available in varies thicknesses |
Applications
AD-DC Power Adapters |
Rainproof LED Power |
Waterproof LED Power |
SMD LED module |
LED Flesible strip, LED bar |
LED Panel Light |
LED floor light |
Routers |
Typical Properties of TIF140--15-5S Series | ||
Color | Blue | Visual |
Construction | Ceramic filled silicone elastomer | ********** |
Thermal Conductivity | 1.5 W/mK | ASTM D5470 |
Hardness | 45±5 Shore 00 | ASTM 2240 |
Specific Gravity | 2.3g/cc | ASTM D297 |
Thickness range | 0.020"~0.200" (0.5mm~5.0mm) | ASTM D374 |
Dielectric Breakdown Voltage (T= 1mm above) | >5500 VAC | ASTM D149 |
Dielectric Constant | 4.5 MHz | ASTM D150 |
Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 |
Continuous Use Temp | – 40 To 160 ℃ | ********** |
Outgassing (TML) | 0.35% | ASTM E595 |
Flame Rating | V-0 | UL E331100 |
Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm)
0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm)
0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm)
0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL