Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Brand Name:Ziitek
Certification:UL
Model Number:TIF050-11
Minimum Order Quantity:1000tube
Delivery Time:3-8 WORK DAYS
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China
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within 2 hours
Product Details
Company Profile
Product Details
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
TIF®050-11 is a soft silicone gel-based gap filler pad, formulated with aspecial blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®050-11 has a high erviscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocesors, PPGAs, micro
BGA packages, BGA packages, DSP chips, circular silicon chips,LED lighting, and other high-power electronic components.
Feature
>Thermal conductivity: 5.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability
Application
>Heat-sink & frame
>LED backlight module, LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment
| TIF®050-11 Typical Properties | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 40 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
| Density(g/cc) | 3.20g/c | ASTM D297 |
| Thermal conductivity | 5.0W/mK | ASTM D5470 |
| Thermal Impedance @10psi (℃.in²w) | 0.077 | ASTM D5470 |
| Thermal Impedance @50psi (℃.in²w) | 0.068 | ASTM D5470 |
| Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
| Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness(mm) | 0.20 | Ziitek Test Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
Product Specification:
30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us
for confirming.
If you want to know our thermal products, please visit our website.
Independent R&D team
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FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
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