Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
Brand Name:Ziitek
Certification:RoHS
Model Number:TIS680-10AB
Minimum Order Quantity:5can
Delivery Time:3-7 work days
Payment Terms:T/T
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
TIS680-10AB-Specification-sheet.pdf
Features
> Good thermal conductive: 1.0W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
>To potting LED Lighting heat spreader and power- driver.
>Ferrite cements; tip type LED; good cementation to aromatic
polyester
>Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics
>Power transformers and coils; Potting capacitors; Potting of
small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates
adhesion; Coatingand sealant; Coil ; IGBTS;Transformer; Fire
retardant
>Optical / medical component adhesive
| Typical Properties of TIS™ 680-10AB Series | |||
| Typical Uncured Material | |||
| TISTM680-10A(Hardener) | Mixing ratio (weight ratio) | ||
| Color | white | A:=1 :1 | |
| Viscosity @25℃ Brookfield | 3500 mPa.s | Viscosity @25℃ Brookfield | 3500 mPa.s |
| specific Gravity | 1.73g/cc³ | specific Gravity | 1.73g/cc³ |
| Shelf life @25℃ in sealed container | 6 months | Working pot life(250g @25℃) | 30 mins |
| TISTM680-10B(Resin) | Cure Schedule | ||
| Color | white | Cure at 25C | 3 hrs |
| Viscosity @25℃ Brookfield | 3500 cPs | ||
| Shelf life @25℃ in sealed container | 6 months | Cure at 7o°c | 20 mins |
| Cured Properties | Value | Test method | |
| Hardness (Shore A)@25℃ | 65 | ASTM D2240 | |
| Operating temperature | -40℃ ~160℃ | ****** | |
| Glass transition temperature Tg | 92℃ | ****** | |
| Elongation | 4.50% | ASTM D412 | |
| Coefficient of thermal expansion, /℃ | 3.0x 10^(-5) | ****** | |
| Fire resistance uL | 94 V-0 | E331100 | |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | < 0.1 | ASTM D570 | |
| Thermal Conductivity | 1.0W/m-K | ASTM D5470 | |
| Thermal Impedance @10psi | 0.48℃*in²/W | ASTM D5470 | |
| Dielectric Breakdown Voltage | 200 volts / mil | ASTM D149 | |
| Dielectric Constant@1MHz | 4.5 | ASTM D150 | |
| volume resistivity, ohm-cm @ 25℃ | 3.0x 10^13 | ASTM D257 | |
Product packaging
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Company profile
Ziitek company is a high-tech enterprise which dedicated to the
R&D, manufacture and sales of the thermal interface materials
(TIMs). We have rich experiences in this field which can support
you the latest, most effective and one -step thermal management
solutions. We have many advanced production equipments,full test
equipments and fully automatic coating production lines which can
support the production for high performance thermal silicone pad,
thermal graphite sheet/ film, thermal double-sided tape, thermal
insulation pad, thermal ceramic pad, phase change material, thermal
grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
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