Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric
Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIS800
Minimum Order Quantity:1000pcs
Delivery Time:3-6 work days
Place of Origin:China
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Supplier`s last login times:
within 2 hours
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Product Details
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Product Details
Chip heat sink manufacturer silicone thermal insulation sheet TIS800 series
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street
lamps, Daylight lamps, LED Server Power products and others.
TIS800 Series Datasheet-(E)-REV01.pdf
The TIS™800 Series products are the high-efficiency insulation ones with thermal conduction properties. The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.
Features:
> Highly compliant surface characteristic with high thermal
conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures
Applications:
> Power conversion equipment
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface
Typical Properties of TIS™800 Series | ||||||
| Product Name | TISTM806 | TISTM808 | TISTM810 | TISTM812 | TISTM818 | Test Method |
| Color | Gray | Gray | Gray | Gray | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone rubber | *** | ||||
| Composite Thickness | 0.006"/0.152mm | 0.008"/0.203mm | 0.010"/0.254mm | 0.012"/0.304mm | 0.018"/0.457mm | ASTM D751 |
| Specific Gravity | 2.2 g/cc | ASTM D297 | ||||
| Heat Capacity | 1 l/g-K | ASTM C351 | ||||
| Hardness | 50 Shore A | ASTM 2240 | ||||
| Tensile Strength | 450 psi | >600 psi | >600 psi | >600 psi | >600 psi | ASTM D412 |
| Continuos Use Temp | (-58 to 356℉) / (-50 to 180℃) | *** | ||||
| Electrical | ||||||
| Dielectric Breakdown Voltage | >1500 VAC | >3500 VAC | >5000 VAC | >5000 VAC | >5000 VAC | ASTM D149 |
| Dielectric Constant | 5.5 MHz | ASTM D150 | ||||
| Volume Resistivity | 5.0X10" Ohm-meter | ASTM D257 | ||||
| Fire rating | 94 V0 | equivalent UL | ||||
| Thermal | ||||||
| Thermal conductivity | 1.6 W/m-K | ASTM D5470 | ||||
| Thermal Impedance @50psi | 0.21℃-in²/W | 0.35℃-in²/W | 0.82℃-in²/W | 1.23℃-in²/W | 1.83℃-in²/W | ASTM D5471 |
Standard Thicknesses:
0.009"(0.228mm) 0.012"(0.304mm)
0.018"(0.457mm)
Consult the factory alternate thickness.
Standard Sizes:
12" x 160'(304mm x 48.76M)
Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.
Reinforcement:
TIS™ series sheets are fiberglass reinforced.
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric
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