3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIF500S Series
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times: within 2 hours
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Product Details

3W/mK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame


The TIF™500S Series TIFTM500s Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins orthe metal base.Their flexibility and elasticity make them suited to coat veryuneven surfaces.Heat can transmit to the metal housing or dissipation platefrom the heating elements or even the entire PCB, which effecitly enhancesthe efficiency and life-time of the heat-generating electronic components.


Features

> Good thermal conductive
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance

Applications

> CPU
> display card
> mainboard/mother board
> notebook
> power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components


Typical Properties of TIF500S Series
ColorBlueVisual
ConstructionCeramic filled silicone elastomer**********
Thermal Conductivity3.2 W/mKASTM D5470
Hardness45 Shore 00ASTM 2240
Specific Gravity3.0 g/ccASTM D297
Thickness range0.020"-0.200" (0.5mm-5.0mm)ASTM D374
Dielectric Breakdown Voltage (T= 1mm above)>5500 VACASTM D149
Dielectric Constant5.5 MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Continuous Use Temp– 40 To 160℃**********
Outgassing (TML)40%ASTM E595
Flame Rating94-V0UL E331100

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.


Company profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

China 3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame supplier

3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

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