0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIF200-02E series
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Verified Supplier
Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating
Thermal Pad For Cpu For Heat Sink
The TIF™200-02E Series thermally conductive interface materials are applied to fill the
air gaps between the heating elements and the heat dissipation fins
or the metal base. Their flexibility and elasticity make them
suited to the coating of the very uneven surfaces. Heat can
transmit to the metal housing or dissipation plate from the
separate elements or even the entire PCB, which in effect enhances
the efficiency and life-time of the heat-generating electronic
components.
Features
> Good thermal conductive: 1.25 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF200-02E Series | ||
| Color | Gray / White | Visual |
| Construction Reinforcement Carrier | Ceramic filled silicone elastomer | ********** |
| Thermal Conductivity | 1.25 W/mK | ASTM D5470 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.2g/cc | ASTM D297 |
| Thickness range | 0.020"-0.200" (0.5mm-5.0mm) | ASTM D374 |
| Dielectric Breakdown Voltage (T= 1mm above) | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.0MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Continuous Use Temp | – 40 To 160 ℃ | ********** |
| Outgassing (TML) | 0.35% | ASTM E595 |
| Flame Rating | 94 V0 | UL E331100 |
Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm)
0.050" (1.27mm)
0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm)
0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm)
0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal
conductive materials, owns advanced production equipment and optimized process, can provide
various thermal solutions for different applications.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
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