4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor

Brand Name:ZMSH
Certification:RoHS
Model Number:4inch Sapphire Wafer
Minimum Order Quantity:10pieces
Delivery Time:2-4weeks
Payment Terms:T/T
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Location: Shanghai Shanghai China
Address: Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
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4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor


Product Description:


Sapphire wafers are composed of aluminum oxide (Al₂O₃), in which three oxygen atoms are covalently bonded to two aluminum atoms. They exhibit a hexagonal lattice crystal structure and are commonly cut along the A-plane, C-plane, and R-plane orientations. Owing to their broad optical transparency range, sapphire wafers transmit light from the near-ultraviolet (190 nm) to the mid-infrared wavelengths, making them an ideal choice for optical components, infrared devices, high-power laser windows, and photomask materials. Sapphire wafers are renowned for their high acoustic velocity, high-temperature resistance, corrosion resistance, high hardness, excellent transparency, and high melting point (2045°C). They are a challenging material to process, but are widely used in optoelectronic devices.


Product Parameters:


Diameter:4inch or 100±0.1mm
Thickness:200±15um500 ± 15 um,650±15um;
Roughness:Ra ≤ 0.2 nm
Warp:≤ 10um
TTV:≤ 10um
Polish:DSP (Double Side Polished); SSP(Single Side Polished)
Shape:Round, Flat, Notch
Wafer Orientation:C Axis
Edge Form:45°, C shape
Material:Sapphire
Remarks:All specifications above can be customized upon your request.

Product Pictures:



Product Highlights:


* Sapphire wafers are with common crystallographic orientations include C‑plane (0001), A‑plane (11‑20), and R‑plane (1‑102); the choice of orientation tailors optical, mechanical, and epitaxial behavior for specific devices.


* Typical optical transmission spans the near‑UV to mid‑infrared (approximately 0.19–5.5 μm), with high transparency in the 0.3–5 μm range, supporting applications in optics and optoelectronics.


* Mechanical and thermal properties of sapphire wafers include a Mohs hardness of 9, high strength and wear resistance, and a melting point ~2050°C, enabling performance under extreme environments.


* Chemical stability of sapphire wafers is excellent—resistant to most acids and alkalis—with notable attack only by HF, phosphoric acid, and molten KOH at elevated temperatures.


* Representative applications of sapphire wafers: LED substrates (GaN on sapphire), infrared and laser windows, optical components, and wear‑resistant covers in consumer electronics.


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Q&A:


Q: What is a sapphire wafer?


A: A sapphire wafer is a circular thin slice made of sapphire material, which is widely used in the manufacturing of semiconductors and optical devices.


Q: What size are sapphire wafers?


A: 2inch, 3inch, 4inch, 6inch, 8inch, 12inch.


Q: How to cut a sapphire wafer?


A: Cutting a sapphire wafer requires specialized methods due to its extreme hardness (9 on the Mohs scale, second only to diamond) and brittleness. The core approach relies on abrasive-based or laser-based techniques to achieve precise, low-damage cuts.



China 4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor supplier

4inch Sapphire Wafer 200um Thickness C Axis Highly Applied for Semiconductor

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