Product Details
Abstract:Wafer Bonder
The Wafer Bonder is a versatile solution for advanced semiconductor
manufacturing, offering reliable direct bonding, anodic bonding,
and thermocompression processes. Designed for high yield and
repeatability, it supports 6- to 12-inch wafers with thickness
flexibility, ensuring precise alignment and process stability for
diverse applications like 3D IC packaging, MEMS devices, and power
electronics.
Equipped with automated handling and intelligent monitoring, the
system minimizes material waste and maximizes uptime. Its modular
design allows quick adaptation to new processes, reducing
operational complexity. Compliant with global industry standards,
the bonder integrates seamlessly with existing production lines and
MES systems, enhancing traceability and efficiency.
Backed by ISO-certified quality and responsive global service, this
platform delivers long-term performance while optimizing
cost-of-ownership for high-volume manufacturing.
Wafer Bonding Techniques
1. Room-Temperature Bonding
Principle:
- Achieves atomic-level bonding between substrates (e.g., Si, glass,
polymers) at ambient temperatures (25–100°C) via surface activation
(plasma/UV treatment).
- Relies on van der Waals forces or hydrogen bonds, requiring
ultra-smooth surfaces (Ra < 0.5 nm).
Applications:
- Flexible electronics (OLEDs, foldable displays).
- Low-temperature MEMS (microscale sensors, biochips).
- Heterogeneous integration (III-V compounds on Si).
Advantages:
- No thermal stress or warping.
- Compatible with temperature-sensitive materials.
Limitations:
- Lower initial bond strength (may require post-annealing).
- High sensitivity to surface contamination.
2. Hydrophilic Bonding
Principle:
- Surfaces are treated with oxygen or nitrogen plasma to generate
hydroxyl (-OH) groups.
- Bonds form via Si-O-Si covalent bonds under vacuum/controlled
atmosphere (150–300°C).
Applications:
- Si-glass bonding (MEMS pressure sensors, optical packaging).
- 3D stacking of silicon dies (memory stacking).
- Biocompatible device fabrication (lab-on-a-chip).
Advantages:
- Low thermal budget (minimizes interfacial defects).
- Excellent planarity for large-area wafers.
Limitations:
- Humidity-sensitive (long-term stability risks).
- Requires precise plasma exposure control.
3. Temporary Bonding
Principle:
- Uses reversible adhesive layers (BCB, UV-curable resins) to attach
wafers to carriers.
- Separation via laser lift-off, thermal slide, or chemical
dissolution.
Applications:
- 3D packaging (thin-wafer handling, fan-out WLP).
- Backside processing (TSV filling, passivation).
- MEMS release (sacrificial layer etching).
Advantages:
- Preserves wafer flatness for downstream steps.
- Compatible with high-temperature post-bonding processes
(>300°C).
Limitations:
- Risk of adhesive residue contamination.
- Separation may induce microcracks.
Applications
ZMSH Wafer Bonder
Frequently Asked Questions (FAQ)
Q: Which bonding method is best for temperature-sensitive materials?
A: Room-temperature bonding or temporary bonding are ideal for
materials like polymers or organic electronics, as they avoid
thermal stress.
Q: How does temporary bonding work?
A:A reversible adhesive layer (e.g., BCB or UV resin) bonds the wafer
to a carrier. After processing, separation is done via laser
lift-off or thermal slide.
Q: Can I integrate bonding with existing lithography tools?
A: Yes, modular bonders can be integrated into fabs with
MES-compatible controls.
Company Profile
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai,
Which is the best city of China, and our factory is founded in Wuxi
city in 2014.
We specialize in processing a varity of materials into wafers,
substrates and custiomized optical glass parts.components widely
used in electronics, optics, optoelectronics and many other fields.
We also have been working closely with many domestic and oversea
universities, research institutions and companies, provide
customized products and services for their R&D projects.
It's our vision to maintaining a good relationship of cooperation
with our all customers by our good reputatiaons.