Product Details
High Temperature Resistant Material PUR Piezo Valve with Luer
Connector
Principle & Control
PUR Piezo Valve
- The PUR Piezo valve is composed of several modules: a barrel
heating module, a pressurized cap module, a nozzle heating module,
a runner module, a valve body module, and a heat dissipation
module.
- The barrel heating module supports the barrel and features a
controllable heating section for the initial warming of the gel.
- The pressurized cap module ensures the barrel is sealed and
pressurized, adjusting the output pressure through a controller.
- The heat dissipation module is responsible for dissipating heat and
reducing noise emitted by the valve body.
- The Piezo-electric injection valve adopts a modular design, where
the gel-contacting part is the runner module and the non-contacting
part is the valve body module.
- Based on specific applications, the runner module can be replaced
to meet different dispensing needs.
- Nozzle diameters vary from 0.03MM to 0.80MM and come in flat jet,
needle, and extension styles.
- Runner modules need regular cleaning in an ultrasonic cleaner. It's
crucial to avoid immersing seals in organic solvents and to use
specialized tools for nozzle cleaning to prevent damage.
Piezo Valve Controller
- The touch screen operates the piezoelectric injection valve and
dispensing system, supporting robust, safe, and reliable 485
communication for control.
- The touch screen features a graphical control interface that
clearly and intuitively displays the dispensing system components
and control functions.
- Nozzle Heating Device: Before dispensing, it's necessary to heat
the nozzle to an appropriate temperature using the single-stage
heating mode of the heating device.
- Maintaining a constant temperature at the nozzle ensures optimal
gel performance by preserving its best qualities.
Nozzle and drum heating
- Prior to glue dispensing, the nozzles undergo a two-stage heating
process to reach an appropriate temperature.
- Maintaining a consistent temperature for the glue by heating both
the barrel and the nozzle ensures its optimal performance.
Specification
Model | HS-YD-PUR30CC | HS-YD-PUR300CC |
Size (L*W*H) | 120mm*50mm*140mm | See attached drawing |
Weight | 0.75kg | 1500g |
Material in contact with fluid | Stainless steel 303, special steel | Stainless steel 303, special steel |
Fluid inlet size | Luer connector | Luer connector |
Needle assembly | Tungsten steel wear-resistant material Φ0.6-Φ3.0mm | Tungsten steel wear-resistant material Φ0.6-Φ2.1mm |
Nozzle assembly | Tungsten steel wear-resistant material Φ0.03~0.8mm | Tungsten steel wear-resistant material Φ0.05~0.3mm |
Heating assembly | 20~220℃ | 20~220℃ |
Fluid seals | High temperature resistant material | High temperature resistant material |
Maintenance intervals for seal assemblies | 20,000,000 times | 20,000,000 times |
Maximum dispensing frequency | 1000Hz (Instantaneous maximum frequency 1500Hz) | 1000Hz (Instantaneous maximum frequency 1500Hz) |
Maximum drive power | 100% | 100% |
Type of glue used | PUR hot melt adhesive 300CC aluminum cylinder packaging | PUR hot melt adhesive 300CC aluminum cylinder packaging |
Applicable viscosity range | 0-20000cps | 0-20000cps |
Fluid temperature range | 80~220℃ | 20~220℃ |
Product Features and Advantages
- Tube heating is perfect for 300CC aluminum tubes filled with
special hot melt glue.
- Its modular design makes parts easy to replace and debugging
straightforward, while also offering a wide range of application
processes.
- The spraying volume can achieve precision as low as 0.3nL, with a
glue point consistency accuracy of up to 98%.
- During the hot melt adhesive spraying process, it can achieve a
minimum line width of 0.17mm and a minimum spot diameter of 0.15mm.
- It is compatible with any motion platform currently available on
the market.
Application Field
Bonding and sealing tasks encompass a variety of applications, such
as assembling cell phone shells, encapsulating new energy
batteries, adhering and sealing touch screens for diverse
electronic devices, enclosing cell phone speakers and receivers,
covering high-end headphones and audio housings, as well as
encapsulating fingerprint recognition modules.
Company Profile
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012
by prefessional and experienced engineer who wroked many years in
EMS company,we specilized in PCB handling equipments at first, then
we develop the PCB depaneling machine and SMT cleaning machine.
HSTECH not only have professional technical team for R&D,but
also have a outgoing and experienced marketing team for research
and develop, grasps products developing directions, updates the
products and technics to meet the continue changing demands. In the
past years,we have been always keep innovating and exploing to make
cost-efficient products to help our customers saving cost and
labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the
concept of "Quality-Oriented and Customer-orented", and combined
the industry feature, smart technology persuit for the smart
factory.As for the after-sale service, we insist on
"responsibility", we will take reaction at the first when we got
quality feedbacks,and service our customers all the time.