Product Details
3 Heating Zones Manual BGA Touch Screen Rework Station with &
CE
Introduction:
A BGA Rework Station is a specialized tool used in electronics manufacturing and repair
to manage the rework and repair of Ball Grid Array (BGA) components
on printed circuit boards (PCBs). These stations are essential for
tasks such as replacing faulty BGA chips, soldering new components,
and performing maintenance on PCBs.
Features:
1.Repair Success Rate:More Than 99%
2.Using The Industrial Touch Screen
3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat.
(temperature accuracy ± 2℃)
4.With CE Certification.
Specification:
Manual BGA Rework Station | Model:HS-520 |
Power Supply | AC 220V±10% 50/60Hz |
Total power | 3800W |
Overall dimension | L460mm*W480mm*H500mm |
PCB size | Max 300mm*280mm Min 10mm*10mm |
BGA size | Max 60mm*60mm Min 1mm*1mm |
PCB thickness | 0.3-5mm |
Weight of machine | 20KG |
Warranty | 3 years (1st year is free) |
Usage Repair | chips / phone motherboard etc |
Applications
Repair and Maintenance:
- Used to repair faulty BGAs on PCBs in various electronic devices,
including smartphones, computers, and industrial equipment.
Prototyping:
- Essential for prototype development in electronics, where
components may need frequent replacement or adjustment.
Rework in Production:
- Employed in manufacturing environments where defects occur during
the production process, allowing for quick turnaround times on
repairs.
Upgrading Components:
- Facilitates the upgrading of existing systems by replacing old BGAs
with newer, more advanced components.
Benefits
- Efficiency: Speeds up the rework process, reducing downtime and increasing
productivity in repair and manufacturing environments.
- Precision: Allows for accurate placement and soldering of components,
ensuring reliable connections and minimizing the risk of defects.
- Cost-Effective: Extends the lifespan of PCBs by enabling repairs rather than
complete replacements, saving costs on materials and labor.
- Versatility: Suitable for a wide range of BGA sizes and types, making it a
valuable tool in various electronic applications.
Company Profile
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012
by prefessional and experienced engineer who wroked many years in
EMS company,we specilized in PCB handling equipments at first, then
we develop the PCB depaneling machine and SMT cleaning machine.
HSTECH not only have professional technical team for R&D,but
also have a outgoing and experienced marketing team for research
and develop, grasps products developing directions, updates the
products and technics to meet the continue changing demands. In the
past years,we have been always keep innovating and exploing to make
cost-efficient products to help our customers saving cost and
labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the
concept of "Quality-Oriented and Customer-orented", and combined
the industry feature, smart technology persuit for the smart
factory.As for the after-sale service, we insist on
"responsibility", we will take reaction at the first when we got
quality feedbacks,and service our customers all the time.