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High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine

High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine

Brand Name:HSTECH
Certification:CE
Model Number:HS-G9+
Minimum Order Quantity:1 set
Delivery Time:7~9 work days
Payment Terms:T/T, Western Union, MoneyGram
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Verified Supplier
Location: Shenzhen Guangdong China
Address: 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Supplier`s last login times: within 24 hours
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Product Details

High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine


Introduction


The G9+ Automatic solder paste printing machine is a high-end machine for SMT high-end application, the width of GT++ BTB is only 2830mm, can perfectly satisfy the printing process requirement of 03015,2025 pitch, high precision and high speed.


Features


1, CCD digital system, total new optical path system, uniform circular light and high brightness of coaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mart point can be easily recognize (including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of different PCB color.


2, High precision PCB thickness adjustment, extremely reliable structure with stable XY movement. Manual adjustment makes it a breeze to accommodate different PCB thickness.
3,Guide rail positioning system, new Pattern guide rail ban detachable, programmable flexible side clamp, specific to FPC, PCB warpage, perform a unique clamping plate device. Through software programming can automatically stretch out and draw back unaffected PCB pickness.
4, New innovative squeegee structure design, adopt a comprehensive squeegee system which enhances stability and long lifespan.
5, High speed stencil cleaning, downward dispensing cleaning structure successfully prevents clogged opening(which is always the root cause for ineffective cleaning) from taking place. The length of solvent dispensedcan also be easilyamended with software control.
6, New multi-function interface, simplicity , clearly understand, friendly user. Actual temperature and humidity monitor function.

Specification
ModelG9+
Max PCB Size450x340mm
Min PCB size50x50mm
PCB thickness0.4-6mm
Max board weight5kg
Transport height900±40mm
Board edge gap2.5mm
Board height15mm
Transport directionL-R,R-L
Transport speedmax 1500mm/s, program control
Transport methodOne stage
WIdth adjustmentautomatic
I/O interfaceSMEMA
PCB positioning (support method)Magnetic pin/support block/manual up-down table
PCB clamping system
Patented over the top clamping
Side clamping
Adsorption function
Print snap-off
0-20mm
Print mode
one/twice
Print Speed
10-200mm/sec
Print Mode
One /Twice
Squeegee Type
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure0.5-10kg
Template fram size470*370mm~737*737mm(20-40thickness)
Cleaning System
Droops of rain type cleaning system
Reinforced vacuum absorption
Dry, wet vacuum three modes
Back and forth cleaning
CCD FOV
10x8mm
Fiducial mark typesStandard Fiducial mark shape
Pad
Hole
Camera systemLook up/down optics structure
CCD digital camera
Geometry pattern match

Machine Performance


ModelG9+
Repeat position accuracy±12.5um@6,CPK≥2.0
Print accuracy±18um@6,CPK≥2.0
Print cycle time<7.5 sec
Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision

Whole Machine Specification


Power supply
AC:220±10%,50/60HZ, 3.0KW
Air pressure
4~6 kgf/cm²
Air consumption
around 5L/min
Operating temperature
-20℃~+45℃
Operating humidity
30%~60%
Machine Dimensions(without tower light)
1172(L) x 1385(W) x 1530 (H)mm
Machine Weight
Approx: around 1000Kg

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China High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine supplier

High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine

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