20w 30w High CRI Chip LED Cob Low Heating Generation For Led Flash Light

Brand Name:TYF
Certification:CE,RoHs
Model Number:ML2421
Minimum Order Quantity:Negotiation
Delivery Time:5-7 days
Payment Terms:D/A, D/P, T/T, Western Union, MoneyGram
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Location: Shenzhen Guangdong China
Address: No.4 Building,XinLianHe Industrial Park JinCheng Road,Shajing Town Baoan District,Shenzhen China
Supplier`s last login times: within 35 hours
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Product Details

20w 30w High CRI Chip LED Cob Low Heating Generation For Led Flash Light


Feature:

• The product has a typical efficacy of 128 lm/W for 3000K, 80 CRI.

• It has a compact high flux density light source.

• The product offers uniform and high-quality illumination.

• Minimum 70, 80, and 90 CRI options are available.

• It has a streamlined thermal path.

• The product is ENERGY STAR® / ANSI compliant with color binning structure with 2, 3, and 5 SDCM standard.

• It is more energy efficient than incandescent, halogen, and fluorescent lamps.

• The product can operate on either high voltage or low voltage DC.

• The product series and company logo are on the front.

• The product is RoHS compliant.


The part number designation for TYF ML Series LED arrays is explained as follows:




Part Number

Typical Power (W)Nominal CCT (K)

CRI

Minimum Pulsed Flux (lm)Typical Pulsed Flux (lm)Typical Voltage (V)Nominal Current (mA)Typical Efficacy (lm/W)
CL25171210P430E*730.63000 K704468480434900157
CL25171210P435E*730.63500 K704553489634900160
CL25171210P440E*730.64000 K704639498834900163
CL25171210P450E*730.65000 K704696504934900165
CL25171210P457E*730.65700 K704724508034900166
CL25171210P465E*730.66500 K704696504934900165
CL25171210P422E*830.62200 K803785407034900133
CL25171210P427E*830.62700 K804013431534900141
CL25171210P430E*830.63000 K804183449834900147
CL25171210P435E*830.63500 K804240455934900149
CL25171210P440E*830.64000 K804297462134900151
CL25171210P450E*830.65000 K804326465134900152
CL25171210P457E*830.65700 K804354468134900153
CL25171210P465E*830.66500 K804326465134900152
CL25171210P422E*930.62200 K903187342734900112
CL25171210P427E*930.62700 K903415367234900120
CL25171210P430E*930.63000 K903586385634900126
CL25171210P435E*930.63500 K903643391734900128
CL25171210P440E*930.64000 K903671394734900129
CL25171210P450E*930.65000 K903700397834900130
CL25171210P457E*930.65700 K903728400834900131

5.1 Color Binning Information


Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)


CIE1931-x


Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range


Nominal

CCT

Center PointMAJOR AXIS (a , b)

Ellipse


Rotation Angel,θ

XY2-Step3-Step5-Step
2200K0.50180.4153(0.0048 , 0.0027)(0.0072, 0.0041)(0.0120, 0.0067)39.9
2500K0.48060.4141(0.0050, 0.0027)(0.0076, 0.0041)(0.0126, 0.0068)53.1
2700K0.45750.4101(0.0053, 0.0027)(0.0080, 0.0041)(0.0133, 0.0068)54.1
3000K0.43380.4030(0.0057, 0.0028)(0.0086, 0.0042)(0.0142, 0.0069)53.7
3500K0.40730.3917(0.0062, 0.0028)(0.0093, 0.0041)(0.0155, 0.0069)54.0
4000K0.38180.3797(0.0063, 0.0027)(0.0093, 0.0042)(0.0157, 0.0068)53.4
5000K0.34470.3553(0.0054, 0.0024)(0.0081, 0.0035)(0.0135, 0.0059)59.8
5700K0.32900.3417(0.0048, 0.0021)(0.0072, 0.0032)(0.0119, 0.0052)58.8
6500K0.31230.3282(0.0044, 0.0018)(0.0066, 0.0027)(0.0110, 0.0045)58.1


Notes for Table 39:

  • Driven the arrays at higher currents however lumen maintenance may be reduced.
  • Proper current derating must be observed to maintain junction temperature below the maximum
  • Pulsed operation with a peak drive current equal to the stated peak pulsed forward current is acceptable if the pulse on-time is ≤1ms per cycle and the duty cycle is ≤10%
  • Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only.



Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode



RECOMMENDED SOLDERING CONDITION

For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a

temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied

to resin part while soldering is implemented. Next process of soldering should be carried out after the product has

return to ambient temperature. CAUTION: TEMPERATURE CONTROL

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20w 30w High CRI Chip LED Cob Low Heating Generation For Led Flash Light

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