CL541818P4 Led Bridgelux Chip 80w Super High Lumen 160lm/W 32-36V 5 Years Warranty

Brand Name:TYF
Certification:CE,RoHs,LM80
Model Number:M54-01l
Minimum Order Quantity:Negotiation
Delivery Time:5-7 days
Payment Terms:D/A, D/P, T/T, Western Union, MoneyGram
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Location: Shenzhen Guangdong China
Address: No.4 Building,XinLianHe Industrial Park JinCheng Road,Shajing Town Baoan District,Shenzhen China
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Product Details

CL541818P4 bridlgeux 80w super high lumen 160lm/w Chips LED COB LM80 5 years warranty


• Efficacy of 160 lm/W typical for 3000K, 80CRI

• Compact high flux density light source

• Uniform, high quality illumination

• Minimum 70, 80, and 90 CRI options

• StreaCLined thermal path

• ENERGY STAR® / ANSI compliant color binning

structure with 2, 3 and 5 SDCM standard

• More energy efficient than incandescent, halogen

and fluorescent lamps

• High voltage or Low voltage DC operation

• Product series and company logo on the front

• RoHS compliant



The part number designation for TYF ML Series LED arrays is explained as follows:




Part Number

Typical Power (W)Nominal CCT (K)

CRI

Minimum Pulsed Flux (lm)Typical Pulsed Flux (lm)Typical Voltage (V)Nominal Current (mA)Typical Efficacy (lm/W)
CL54351818P430E*782.93000 K70120271293251.21620156
CL54351818P435E*782.93500 K70121811309851.21620158
CL54351818P440E*782.94000 K70122581318151.21620159
CL54351818P450E*782.95000 K70124131334751.21620161
CL54351818P457E*782.95700 K70124901343051.21620162
CL54351818P465E*782.96500 K70124131334751.21620161
CL54351818P422E*882.92200 K80101001086051.21620131
CL54351818P427E*882.92700 K80109481177251.21620142
CL54351818P430E*882.93000 K80112561210351.21620146
CL54351818P435E*882.93500 K80114101226951.21620148
CL54351818P440E*882.94000 K80114871235251.21620149
CL54351818P450E*882.95000 K80116421251851.21620151
CL54351818P457E*882.95700 K80117961268451.21620153
CL54351818P465E*882.96500 K80116421251851.21620151
CL54351818P422E*982.92200 K908943961651.21620116
CL54351818P427E*982.92700 K9097911052851.21620127
CL54351818P430E*982.93000 K90100231077751.21620130
CL54351818P435E*982.93500 K90101771094351.21620132
CL54351818P440E*982.94000 K90102541102651.21620133
CL54351818P450E*982.95000 K90104081119251.21620135
CL54351818P457E*982.95700 K90104851127551.21620136



5.1 Color Binning Information


Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)


CIE1931-x


Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range


Nominal

CCT

Center PointMAJOR AXIS (a , b)

Ellipse


Rotation Angel,θ

XY2-Step3-Step5-Step
2200K0.50180.4153(0.0048 , 0.0027)(0.0072, 0.0041)(0.0120, 0.0067)39.9
2500K0.48060.4141(0.0050, 0.0027)(0.0076, 0.0041)(0.0126, 0.0068)53.1
2700K0.45750.4101(0.0053, 0.0027)(0.0080, 0.0041)(0.0133, 0.0068)54.1
3000K0.43380.4030(0.0057, 0.0028)(0.0086, 0.0042)(0.0142, 0.0069)53.7
3500K0.40730.3917(0.0062, 0.0028)(0.0093, 0.0041)(0.0155, 0.0069)54.0
4000K0.38180.3797(0.0063, 0.0027)(0.0093, 0.0042)(0.0157, 0.0068)53.4
5000K0.34470.3553(0.0054, 0.0024)(0.0081, 0.0035)(0.0135, 0.0059)59.8
5700K0.32900.3417(0.0048, 0.0021)(0.0072, 0.0032)(0.0119, 0.0052)58.8
6500K0.31230.3282(0.0044, 0.0018)(0.0066, 0.0027)(0.0110, 0.0045)58.1


6.1 Table 39: Maximum Ratings


Notes for Table 39:

  • Driven the arrays at higher currents however lumen maintenance may be reduced.
  • Proper current derating must be observed to maintain junction temperature below the maximum
  • Pulsed operation with a peak drive current equal to the stated peak pulsed forward current is acceptable if the pulse on-time is ≤1ms per cycle and the duty cycle is ≤10%
  • Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only.



Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode



RECOMMENDED SOLDERING CONDITION

For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a

temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied

to resin part while soldering is implemented. Next process of soldering should be carried out after the product has

return to ambient temperature. CAUTION: TEMPERATURE CONTROL



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