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SOP-210 automatic multi-tube burner (10 in 11 out) oblique back
SSOP-210 automatic single tube burner (1 in 2 out) oblique back
Product introduction:
The APG01-Xx series of automatic burning machines are designed for
the burning and testing of chips for factories, solution companies,
chip sales and production companies. The product adopts
microcomputer control, which has the advantages of high efficiency
and low error rate, and solves the problem of low efficiency and
high defect rate which most companies currently use for manual
burning. The product adopts LCD liquid crystal Chinese display,
which is simple and intuitive, easy to operate and affordable.
Single tube automatic burner
SSOP-150 automatic single tube burner automatic single tube burner
automatic single tube burner
product information:
Product Name: Single tube automatic burner
Brand: Gongshun
Model: APG01-Xx
Support chip: It is mainly used for chips of 3, 6, 8, 10, 14, 18,
20, 24, 28, 32 pins in DIP/SDIP/SOP/SSOP/TSSOP package.
1 input and 2 output automatic burner details:
The APG01-Xx series of automatic burning machines are designed for
the burning and testing of chips for factories, solution companies,
chip sales and production companies. The product adopts
microcomputer control, which has the advantages of high efficiency
and low error rate, and solves the problem of low efficiency and
high defect rate which most companies currently use for manual
burning. The automatic burning machine adopts LCD liquid crystal
Chinese display, which is simple and intuitive, convenient to
operate and affordable.
The APG01-Xx series is a fully automatic programming and testing
automation equipment with 1 tube and 2 tubes. You can set to burn
and test one IC or two ICs each time. Treatment efficiency:
1500PCS/hour or more, one machine replaces the workload of three
people, saving a lot of workers' wage costs. Mainly applicable to
chips of 3, 6, 8, 10, 14, 18, 20, 24, 28, 32 pins in
DIP/SDIP/SOP/SSOP/TSSOP packages. The automatic burning machine can
be equipped with a burner of various manufacturers on the market.
The APG01-Xx series ic automatic burning machine model and chip
support package are as follows:
◇ APG01-D1: Supports DIP300mil package IC with pin spacing of
1.27mm.
◇ APG01-D2: Supports DIP300mil package IC with pin spacing of
2.54mm.
◇ APG01-S1: Supports SOP300mil package IC with 1.27mm pin pitch.
◇ APG01-S2: Supports SOP150mil package IC with 1.27mm pin pitch.
◇ APG01-S3: Supports SOP209mil package IC with 1.27mm pin pitch.
◇ APG01-R1: Supports SSOP150mil package IC with 0.65mm pin pitch.
◇ APG01-T1: Supports TSSOP173mil package IC with pin pitch 0.65mm.
◇ APG01-T2: Supports TSSOP209mil package IC with pin pitch 0.65mm.
◇ Our company can also customize APG01-Xx IC automatic burning
machine according to customer's specific requirements.
1 input and 2 output automatic burner specifications:
Size: L300*W300*H400mm
Weight: 15KG
Color: beige
Suitable for chips: DIP/SOP/SSOP/TSSOP
Input voltage: 220VAC 50HZ
Input line length: 150CM
Input plug: three feet (national standard GB2099)
Power: 100W (working full load maximum power)
Working temperature: 0°C-+40°C
Working humidity: 20%-90% R.H
Storage temperature: -20 ° C - +75 ° C
Storage humidity: 20%-90% R.H