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General description
This is a type of 4 Layer Rogers PCB built on 0.508 mm (20 mil)
RO4350B with Tg 280°C for the
application of GPS tracker. Multilayer PCB's on Rogers material
have different structure (stack up)
from FR-4 multilayer PCB's, because the core of Rogers material is
semi-manufactures. For this 4
layer high frequency PCB, it uses 2 cores of 20mil RO4350B. Usually
blind via from layer 1 to layer
3 is hard to be drilled. On the other hand, the back drill
technology can solve this problem of signal
integrity.
Basic specifications
Base material: RO4350B 20 mil + RO4450B 4 mil
Layer count: 4 layers
Type: Mixed multiplier milled separately
Format: 70mm x 125mm = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 um/ Inner layer 18 um
Solder mask / Legend: Green / white
Final PCB height: 1.42 mm
Standard: IPC 6012 Class 2
Packing: Each 25 panels are packed for shipment.
Lead time: 12 working days
Shelf life: 6 months
Features and benefits
Excellent high frequency performance due to low dielectric
tolerance and loss;
Low thermal coefficient of dielectric constant;
Stable electrical properties verus frequency;
Back drilling reducing noise interference;
ISO9001, ISO14001, UL certified manufacturing factory;
Strict WIP inspection and monitoring as well as working
instruction;
30000 square meter month capability;
8000 types of PCBs per month;
Product capability
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-1, Aluminium, Metal based | |
Layer No. | 1-18 | |
Finished Board thickness | 0.2 mm-3.8mm'(8 mil-150 mil) | |
Board Thickness Tolerance | ±10% | |
Cooper thickness | 0.5 OZ-6OZ (18 um-210um) | |
Copper Plating Hole | 18-40 um | |
Impedance Control | ±10% | |
Warp&Twist | 0.70% | |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) | |
Images | ||
Min Trace Width (a) | 0.075mm (3mil) | |
Min Space Width (b) | 0.1mm (4 mil) | |
Min Annular Ring | 0.1mm (4 mil) | |
SMD Pitch (a) | 0.2 mm(8 mil) | |
BGA Pitch (b) | 0.2 mm (8 mil) | |
0.05mm | ||
Solder Mask | ||
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) | |
Soldermask Clearance (b) | 0.1mm (4 mil) | |
Min SMT Pad spacing (c) | 0.1mm (4 mil) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Min Hole size (CNC) | 0.2 mm (8 mil) | |
Min Punch Hole Size | 0.9 mm (35 mil) | |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm | |
Hole Position Tol | ±0.075mm | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-5u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm | |
Beveling | 30°45° | |
Gold Finger angle | 15° 30° 45° 60° | |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate,CQC certificate |