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PCB Description | Our PCB Board Capability | ||
PCB Surface Finishes | electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver | ||
PCB Max. Size | 1200mm×600mm | ||
PCB Min. Size | 5mm×5 mm | ||
Bow & Twist Tolerance | Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% | ||
Min. Board Thickness & Tolerance | 0.2mm±0.08mm | ||
PCB Min. trace/spacing | Tin board:0.2mm±20%(8mil±0%) | ||
gold board:0.075mm±20%(3mil±0%) | |||
Copper to Board Edge Spacing | 0.5mm(20mil) | ||
Hole to Trace Spacing | 0.3mm(12mil) | ||
Min. Hole Diameter | 0.2mm±.076mm(8mil±3mil) | ||
Min. Hole Clearance | 0.4mm±.076mm(16mil±3mil) | ||
Copper Thickness on Hole Wall | 20-25um(0.79mil-1.0mil) | ||
Hole Location Tolerance | ±0.076mm(l±3mil) | ||
Min Diameter of Punching Hole | FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) | ||
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) | |||
PCB Min. Punching Slot | FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) | ||
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) | |||
Trace width variation | ±0.076mm(±3mil) | ||
Outline Tolerance | Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) | ||
V-CUT Registration Tolerance±0.2mm (±8mil) | |||
PCB BOARD Type | Single-sided, double-sided, multi-layer | ||
Major Material | FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base | ||
PCB BOARD Thickness | 0.2-3.5mm | ||
Base Copper Thickness | 11um 35um 70um 105um | ||
Max. aspect ratio(board thickness: hole size) | 8:1 | ||
V-Cut Angle Tolerance | ±5° | ||
V-Cut Board Thickness | 0.4mm -3.2mm(16mil -128mil) | ||
Min SMT Pitch | 0.3mm(12mil) | ||
Min. Component mark | 0.15mm(6mil) | ||
Min. width of annular ring(finished) | 0.15mm(6mil)/side | ||
Min pad opening | 0.076mm(3mil) | ||
Min S/M Bridge | ±0.076mm(±3mil) | ||
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times | |||
Technology | |||
Min trace/space(inner/external) | 3/3 mil0.075/0.075mm | ||
Min drill size for through hole | drill 8.0 mil0.20mm | ||
Laser dill | 4 mil0.1mm | ||
Copper Foil Thickness | 17-210um | ||
Inner Core Thickness | ±0.08mm | ||
Tolerance of total board thickness | ±0.015mm | ||
Max .Unit Area | 700-800 | ||
Min. Unit Area | 2-5mm | ||
Max Layer | 1-18 Layers | ||
Surface Treatment | |||
Solder Coating Thickness Sn | 4-20um | ||
Cobalt/ Gold plating, Hard Gold Thickness | Ni:5-10umAu:0.05-0.20um | ||
Gold/Nickel Plating Thickness | Ni:5-10umAu:0.05-0.15um | ||
OSP Coating Thickness | 0.2-0.5um | ||
Electroness Au Thickness | Ni:3-15umAu:0.025-0.10mm | ||
Chem .Tin Thickness | Sn:0.8-5um | ||
Producting Capacity | each day :800-100m2 | ||
Aspect Ratio | 6:01:00 | ||
Hole Registration | 0.004" (0.1mm) |
Applied:
1. Communication device (such as mobile phone, pager, telephone,
facsimile machine)
2. Computer device (such as CD driver, dvd driver, hard disk
driver, Soft disk driver, PDA, handheld computer, note-book
computer, lcd-screen, laser printer, ink-jet printer, stylus
printer, etc. )
3. Househeld electronical product (vcd, DVD, HDTV, digital cameras,
digital video camera etc. )
4. Field survey instruments(digital theodolite, total station, etc)
5. Automotive instruments and meters
6. Industrial instruments and meters, , medical apparatus and
others.
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