HDI Blind Burried Holes PCB Manufacturer 4-10 Layers FR4 Printed Circuit Boards HDI Printed Circuit Boards

Brand Name:KAZpcb
Certification:ISO9001 | UL ( E337072 ) | TS16949 ( 0259279 ) | RoHS
Model Number:PCB-B-006
Minimum Order Quantity:1
Delivery Time:3-5dsays
Payment Terms:Paypal, T/T, Western Union
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

Blind / Burried Holes 4-10 Layers FR4 HDI Printed Circuit Board PCB


Detaill specification

Product nameMultilayer FR4 ENIGHASLOSP HDI Printed Circuit Boards With Blind&Burried holes
MaterialFR-4
Surface treatmentENIG/ HASL/ OSP and so on
Board thickness0.6-1.6mm or more thicker
Copper thickness0.5-3oz
SoldermaskBlack/ Green/ Red/ Blue
SilkscreenWhite
CertificatesISO9001 | UL ( E337072 ) | TS16949 ( 0259279 ) | RoHS

Shenzhen KAZ Circuit Co., Ltd.


Brief introduction

Shenzhen KAZ Circuit Co., Ltd, found in 2007, is a PCB and PCBA custom-made manufacturer. It's commitment to high precision single, double-sided, multilayer printed circuit board and metal substrate circuit board production,which is a hightech enterprises including amnufacture, sales, service and so on.

We are confident to provide you quality products with factory-directed price within the fastest delivery time!


What KAZ Circuit can do for you:

  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP

Manufacturer Capacity:


CapacityDouble Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap4/4 mil (1mil=0.0254mm)
Board Thickness0.3~4.0mm
Layers1~20 layers
MaterialFR-4, Aluminum, PI
Copper Thickness0.5~4oz
Material TgTg140~Tg170
Max PCB Size600*1200mm
Min Hole Size0.2mm (+/- 0.025)
Surface TreatmentHASL, ENIG, OSP

HDI printed circuit boards, also known as microvia or μvia PCBs, are an advanced PCB technology that enable high-density interconnections and miniaturized electronic components.


Key features and functions of HDI printed circuit boards include:


Miniaturization and increased density:
HDI PCBs feature smaller, more closely spaced vias and vias, allowing for higher interconnect density.
This makes it possible to design more compact, space-saving electronic devices and components.


Microvias and Stacked Vias:
HDI PCBs use microvias, which are smaller, laser-drilled holes that are used to connect different layers of the PCB.
Stacked vias, where multiple vias are stacked vertically, can further increase interconnect density.


Multi-layer structure:
HDI PCBs can have a higher layer count than traditional PCBs, typically 4 to 10 or more.
The increased number of layers allows for more complex routing and more connections between components.


Advanced materials and processes:
HDI PCBs often use specialized materials such as thin copper foil, high-performance laminates, and advanced plating techniques.
These materials and processes enable the creation of smaller, more reliable, higher-performance interconnects.


Improved electrical properties:
The reduced trace widths, shorter signal paths, and tighter tolerances of HDI PCBs help improve electrical performance, including improved signal integrity, reduced crosstalk, and faster data transmission.


Reliability & Manufacturability:
HDI PCBs are designed for high reliability, with features like improved thermal management and enhanced mechanical stability.
Manufacturing processes for HDI PCBs, such as laser drilling and advanced plating techniques, require specialized equipment and expertise.


HDI printed circuit board applications include:

Smartphones, Tablets, and Other Mobile Devices

Wearable Electronics and IoT (Internet of Things) Devices

Automotive electronics and advanced driver assistance systems (ADAS)

High speed computing and telecommunications equipment

Military and aerospace electronic equipment

Medical devices and instruments


The continued demand for miniaturization, enhanced functionality, and higher performance in a variety of electronic products and systems has driven the adoption of HDI PCB technology.


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China HDI Blind Burried Holes PCB Manufacturer 4-10 Layers FR4 Printed Circuit Boards HDI Printed Circuit Boards supplier

HDI Blind Burried Holes PCB Manufacturer 4-10 Layers FR4 Printed Circuit Boards HDI Printed Circuit Boards

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