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Soft Thermally Conductive Material Thermal Conductive Heatsink Silicone Gap Interface Pad

Soft Thermally Conductive Material Thermal Conductive Heatsink Silicone Gap Interface Pad

Brand Name:Adcol
Certification:ISO9001, CE
Model Number:A-gapfill 260
Minimum Order Quantity:10
Delivery Time:3 - 4 weeks
Payment Terms:T/T , Paypal
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Location: Guangzhou Guangdong China
Address: No. 10, Zhuanchang Road, Xintang Town, Zengcheng, Guangzhou, China
Supplier`s last login times: within 48 hours
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Soft Thermally Conductive Material Thermal Conductive Heatsink Silicone Gap Interface Pad



​A-gapfill 200 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not requiring additional adhesive coating, the
​A-gapfill 200 can inhibit thermal performance. This gap filler is both electrically insulating and stable from -40°C to 160°C and meets UL 94 VO rating.

FEATURES
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.1 W/mK thermal conductivity
• Available in thicknesses from 0.010” (0.25mm) to 0.200” (5.0mm)

APPLICATIONS
• Cooling components to the chassis or frame
• High speed mass storage drives
• RDRAM memory modules
• Heat pipe thermal solutions
• Automotive engine control units
• Wireless communication hardware

 A-gapfill 260
Construction & CompositionCeramic filled
silicone elastomer
ColorLight Gray
Thickness0.06" (1.524mm)
Thickness Tolerance
± 0.006" (± 0.15mm)
Density1.73 g/cm3
Hardness45 Shore 00
Tensile Strength48 psi
% Elongation60.6
Outgassing TML
(post cured)
0.34%
Outgassing CVCM
(post cured)
0.10%
UL Flammability Rating94 VO
Temperature Range-45°C to 160°C
Thermal Conductivity1.1 W/mK
Total Thermal resistance @ 100 psi @69KPa2.05 °C-in2/W
13.23 °C-cm2/W
Coefficient of Thermal Expansion229 ppm/°C
35°C to 130°C
Breakdown voltage>27,000 Volts
Volume resistivity4 x 1013 ohm-cm
Dielectric constant @ 1MHz5.5

STANDARD THICKNESS
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm) Consult the factory for alternate thicknesses

STANDARD SHEET SIZE
9" x 9" (229mm x 229mm) A-gapfill 200 may be die cut into individual shapes. Pressure sensitive adhesive is not applicable for Tflex™ products.

REINFORCEMENT
0.020" (0.51mm) and 0.030" (0.762mm) are fiberglass reinforced.

China Soft Thermally Conductive Material Thermal Conductive Heatsink Silicone Gap Interface Pad supplier

Soft Thermally Conductive Material Thermal Conductive Heatsink Silicone Gap Interface Pad

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