18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

Brand Name:JIMA
Certification:SGS, ISO,Reach, RoHS
Model Number:EDCU
Minimum Order Quantity:10kg
Delivery Time:5-15 days
Payment Terms:T/T, L/C
Contact Now

Add to Cart

Verified Supplier
Location: Shanghai Shanghai China
Address: No.60 Guoxia Road, Yangpu District, Shanghai,China.
Supplier`s last login times: within 48 hours
Product Details Company Profile
Product Details

18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing/High-Speed Copper Clad Laminates


JIMA Copper is doing copper foil of Li-ion battery 4.5um to 14um more than 12 years. and production capacity 150000tons /years.


Features:


1,Special silane treatment with high peel strength


2,Nanoscale treatment of copper nodules


3,Excellent anti-oxidation and shelf life


4,Enhanced Bonding Strength


5,Smooth Surface Finish,High Electrical Conductivity


6,Improved Flexibility,Resistance to Corrosion


7,Diverse Thickness and Width Options


8,It has better etching performance. It can effectively shorten the production process, achieve higher speed and fast micro-


etching, and improve the qualification rate of printed circuit boards.


Application:


1,High Density Interconect(HDI)


2,High speed digital


3,Production of high-frequency and high-speed copper clad laminates


4,Communication electronic equipment (Base station / Server routers, switches)


5,Computer hardware


6, PCB board manufacturing


7, Semiconductor industry


8, Electromagnetic shielding and heat conduction


9,Multilayer board;high-frequency board



Details Package: wooden box

FAQ:


Q1: delivery time ?

A: The general delivery time is 10~15 working days.


Q2: What's your minimum order quantity?

A: The MOQ is 10kg.

Q3. what is your standard width?

A:
300mm 500mm 600mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.

18μm RTF Reverse Copper Foil Series standard sample digital:


Specifications standard sample(35 μm)


Mechanical Properties
                        
Ra on matte side Rz
<2.5 μm
Tensile strength
>330 MPa
Elongation
>5%
peel strength(FR4)
≥1.5 N/mm(FR4)

18μm RTF Reverse Copper Foil Series Technical Data Sheet:


Project
                        
Unit
                        
Technical requiremente
                        
Thickness
                        
μm
18
35
70
Unit Area Weight
                        
g/m2
145±5
275±5
585±5
Roughness 
                        
M side Rz
μm
≤3.5
≤5.0
≤8.0
S side Rz
μm
≤3.0
≤3.0
≤3.0


Tensile Strength
                        
25℃
MPa
≥320
≥320
≥320


Elongation
                        
25℃
%
≥5
≥8
≥8


Peel Strength
                        
N/mm
1.2
1.2
1.2
Antioxidant Capacity
                        
-
200℃ 40min No oxidation
                        

Remark: accept customization, Standard Width,100-1440(±1)mm,


China 18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates supplier

18μM RTF Reverse Copper Foil Series For PCB Board Manufacturing / High-Speed Copper Clad Laminates

Inquiry Cart 0