Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit / CCL
Brand Name:JIMA
Certification:ISO9001：2008,ISO14001:2004，T28001-2011
Model Number:EDCUHTE
Minimum Order Quantity:Negotiations
Delivery Time:10~20days
Payment Terms:L/C, T/T
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Location:
Shanghai Shanghai China
Address:
No.60 Guoxia Road, Yangpu District, Shanghai,China.
Supplier`s last login times:
within 48 hours
Product Details
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Product Details
HTE 17um ED copper foil for High speed circuit with Good etch ability.
Products Detail:
a.single side side treatment low profile foil in back/red.
b.Nominal Thickness: 0.017mm.
c.Width: 5-1380mm,standard width:1290mm.
d.ID: 76 mm,152 mm.
e.Cu purity :99.8%.
f.Quality standard:IPC 4562.
Products use Application:
1.Polyimide board
2.Epoxy board
3.PCB and antenna PCB,FPC
Description.
.Excellent adhesion to etching resist..
.Anti foil cracking by high elongation at elevated temperature.
.Eco-friendly products and processes.
Compare between CA copper foil and ED copper foil
1. Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.
2. Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.
HTE copper foil Technical Parameters sheet (high elongation copper foil at high temperature)
| Thickness | um | 9 | 12 | 18 | 25 | 35 | 70 | IPC 4562 4.6.3.1 | |
| Area weight | g/m² | 80±1 | 107±3 | 153± | 215±5 | 285±5 | 585±8 | IPC 4562 4.6.3.2 | |
| Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | IPC 4562 4.6.9 |
| (RZ) | μm | <6.0 | <6.5 | <8.0 | <9.0 | ≤10.0 | <15 | ||
Copper≥ | % | 99.8 | IPC 4562 4.6.3.1 | ||||||
| Tensile Strength | state normal | Mpa | >300 | >300 | >300 | >300 | >300 | >280 | IPC 4562 4.6.4 |
| state temper (180℃) | Mpa | >15.0 | >18.0 | >18.0 | >18.0 | >18.0 | >18.0 | ||
| ElongationI | state normal | % | >3.0 | >3.0 | >5.0 | >6.0 | >10.0 | >10.0 | IPC 4562 3.5.3 |
| state temper (180℃) | % | >2.0 | >2.5 | >2.5 | >3.0 | >5.0 | >5.0 | ||
| Peel strength | N/mm | >1.0 | >1.05 | >1.35 | >1.70 | >1.8 | >2.0 | IPC 4562 4.6.7 | |
High temperature oxidation resistance(200℃, 40min) | No color change | Standard | |||||||
| Solderability | Good | Standard | |||||||
| Solderability | Good | IPC 4562 4.6.12 | |||||||
Remark:
1.Standard Width,1295(±1)mm,May according to the customer request tailor.
2.We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.
FAQ:
Q1. Is it possible be zinc free copper foil?
Yes ,we can do it.
Q2. Can you provide COA?
Yes , we can.
Q3. Is it the Fumigation carton box?
Yes ,it is .
Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit / CCL
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