SMT 3D ASC Vision SPI-7500 Automatic Optical Inspection , PCB Solder Paste Inspection

SMT 3D ASC Vision SPI-7500 Automatic Optical Inspection PCB Solder Paste Inspection Machine

Product parameter
Application range: Solder paste. Red glue. BGA.FPC.CSP
Measurement item: Thickness; area; volume;.3D shape; plane distance
measuring principle: Automatic measurement and display of PCB deformation
or tilt angle by laser trigonometric function method
Software language:Chinese / English
Lighting source: White highlights LED
Measuring light source: red laser module
X/Y range: Standard 350mm*340mm (larger size can be customized)
Measurement mode: Automatic full screen measurement. Box selection,
automatic measurement. Frame selection, manual measurement
Range of vision:12mm*15mmn
Camera pixel:3 million / field
Maximum resolution:0.1umn
Scanning interval:5 um /10 um /15 um /20 um
Repeated measurement accuracy :Height<±1um,area<1%,volume<1%n magnification 50X
Maximum measurable height:5mm
Maximum measurement speed: 250Profiles/s
3D mode: Surface. Line. Point 3 different 3D simulation chart, zoom. Rotate
SPC software: Production data, printed data, solder paste data, steel mesh data,
and measurement results are independently analyzed X-Bar&R chart analysis,
histogram analysis, &Ca/Cp/Cpk output, Sigma automatic judgment.
operating system: Windows7
Power supply: 220V 50/60Hz
Maximum power: 500W
Weight: 85KG
Size: L*W*H(700mm*800mm*400mm)

• 1. product features

Fast programming, friendly programming interface
Multiple measurement methods
Real one button measurement
Eight Party movement button, one button focus
Adjustable scanning interval
Paste 3D simulation function
Powerful SPC capabilities
Automatic correction of MARK deviation
One button back to screen center function

• 2. product features

Automatic identification target
The automatic 3D solder paste thickness tester can 3D data of each point is obtained by scanning the paste of mobile /Z XY platform automatic axis image auto focusing and laser, can also be used to measure the average thickness of solder pads, the solder paste printing process is controlled well.
[Characteristics]
1. programmable measurement of a number of regions, automatic focus at different test points, overcome the error caused by plate deformation;
2. automatically check the location and correct the offset through the PCB MARK;
3. measuring method: automatic, automatic movement, manual measurement, manual movement, manual measurement;
4. solder paste 3D simulation diagram, reproduce the true appearance of solder paste;
5. 3 axis automatic movement, focusing, automatic compensation to correct the warpage of the substrate, to obtain accurate paste height;
6. high speed and high resolution camera, high precision, powerful, SPC data statistic analysis;
7.SIGMA automatic discrimination function, so that your operator has real-time identification of solder paste printing process quality;
8. automatically generate CP, CPK, X-BAR, R-CHART, SIGMA, column charts, trends, pipes
9.2D auxiliary measurement, distance between two points, area, size, etc.;
10. the list of measurement data is automatically saved and SPC reports are generated
3 different 3D dynamic display modes can be switched in real-time to zoom in, zoom out and rotate

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