Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Brand Name:UNICOMP
Certification:CE, FDA
Model Number:AX9100max
Minimum Order Quantity:1 set
Delivery Time:15 days
Payment Terms:L/C,T/T
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Location: Shenzhen Guangdong China
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Supplier`s last login times: within 1 hours
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Product Details
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

The Unicomp AX9100max X-ray Inspection Systemis engineered specifically for IGBT module analysis and serves a broad range of industries, including:

BGA/CSP/Flip Chip packaging

LED & optoelectronic components

Fuse & diode manufacturing

PCB & semiconductor assembly

Battery production

Small metal castings

Electronic connector modules & cables

Photovoltaic (PV) cell inspection


Application Fields
Application fields of Unicomp AX9100max X-ray Machine

Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image












Sample inspection image from Unicomp AX9100max X-ray Machine

Technical Parameters and Specifications





































Technical specifications of Unicomp AX9100max X-ray Machine

Dimensions and Appearance
























Dimensions and appearance of Unicomp AX9100max X-ray Machine
China Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) supplier

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

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