UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100

Brand Name:UNICOMP
Certification:CE, FDA
Model Number:AX9100
Minimum Order Quantity:1Set
Delivery Time:30 days
Payment Terms:T/T, L/C
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Location: Shenzhen Guangdong China
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Supplier`s last login times: within 1 hours
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Product Details

Metal X Ray Machine for BGA connectivity and analysis AX9100


ItemDefinitionSpecs
System ParametersSize1350(L)x1250(W)x1700(H)mm
Weight1900kg
Power220AC/50Hz
Power Consumption1.6kW
X-ray TubeTypeClosed
Max.Voltage130kV
Max.Power40W
Spot Size7μm
X-ray SystemIntensifierFPD
Monitor22 ‘’LCD
System Magnification1600 X
Detection RegionMax.Loading SizeΦ570mm
Max.Inspection Area450mm x 450mm
X-ray Leakage<1μSv/h

Applications


Solder reflow analysis


BGA connectivity and analysis


Solder void calculation


Through hole measurement and inspection


Die attach voiding measurement


Ball bond analysis


Stitch bond analysis


Micro BGA / chip on chop analysis


Pad array analysis


Dry joint detection and analysis



Installation


Unicomp will provide installation and calibration service at the customers location Installation includes assistance in registering your new x-ray system with local and state agencies where applicable. One (1) on-site radiation survey at the time of installation with supporting documents.


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China UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100 supplier

UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100

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