Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System

Brand Name:ROYAL
Certification:ISO, CE, UL Standard
Model Number:RTSP1215-MF
Minimum Order Quantity:1 set
Delivery Time:8 to 12 weeks
Payment Terms:L/C, D/A, D/P, T/T
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Address: 819# SONGWEI ROAD (N.) SONGJIANG INDUSTRIAL ZONE, SHANG HAI, CHINA 201613
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Copper Circuit Board TiN PVD Coating Machine / PVD TiN Decorations Plating on Brass Board


The PVD machine model: RTSP1215-MF is designed and developed to deposit TiN gold coating on Copper circuit board. The TiN thin film generated in high vacuum environment, which highly enhanced the uniformity and purity.


Copper Circuit Board TiN PVD Coating Machine design features:

1. 8-sides chamber with equal sizes mounting flanges, which can assemble and exchange Ion source and Sputtering cathodes or Arc cathodes flexiblely based on the coating processes demand.

2. Compact design which only occupy 20sqm;

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. High pumping speed package and stable configuration, the magnetically suspension molecular pumps can be mounted in any direction.


Copper Circuit Board TiN PVD Coating Machine Specifications


Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually


Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System


RTSP1215-MF Technical Data
MODELRTSP1215-MF
TECHNOLOGYMagnetron Sputtering (MF)
MATERIALStainless Steel (S304)
CHAMBER SIZEΦ1200*H1500mm
CHAMBER TYPE8-sides, vertical, 1-door
SPUTTERING SYSTEM4 sets Planar Sputtering Cathodes
DEPOSITION MATERIALAluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium, TiN
DEPOSITION SOURCE4 Planar Sputtering Cathodes + Ion Source for Plasma cleaning
GASMFC- 2 ways, Ar, N2
CONTROLPLC(Programmable Logic Controller) +
Touch Screen
PUMP SYSTEMSV300B - 1 set (Leybold)
WAU1001 - 1 sets (Leybold)
D60T- 1 set (Leybold)
MGK3304 - 2 sets ( Osaka)
PRE-TREATMENTBias power supply: 1*36 KW
SAFETY SYSTEMNumerous safety interlocks to protect operators
and equipment
COOLINGCold Water
POWER ELECTRICAL480V/3 phases/60HZ ( USA compliant)
460V/3 phases/50HZ ( Asia compliant)
380V/3 phases/50HZ ( EU-CE compliant)
FOOTPRINTL3000*W3000*H2000mm
TOTAL WEIGHT7.0 T
FOOTPRINT( L*W*H) 5000*4000 *4000 MM
CYCLE TIME30~40 minutes (depending on substrate material,
substrate geometry and environmental conditions)
POWER MAX..110KW
AVERAGE POWER CONSUMPTION (APPROX.)50 KW


Copper Circuit Board TiN PVD Coating Sample




Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

China Copper Circuit Board TiN Coating Machine ,  MF Magnetron Sputtering System supplier

Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System

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