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AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine

AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine

Brand Name:ROYAL
Certification:CE certification
Model Number:RTAS1215
Minimum Order Quantity:1 set
Delivery Time:12 weeks
Payment Terms:L/C, D/A, D/P, T/T
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Address: 819# SONGWEI ROAD (N.) SONGJIANG INDUSTRIAL ZONE, SHANG HAI, CHINA 201613
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Product Details

AlN Chips Copper Sputtering Depostion System, Aluminum Nitride PVD Copper Sputtering Machine


Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually


Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System


Copper Sputtering Coating Machine Key Features


1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit.

2. Multilayer and co-deposition coating available

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. Ceramic/ Al2O3/AlN substrates heating up unit;

5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating.


Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate


The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate.

Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its high feature.

Royal technology team assited our customer to developed the DPC process sucessfully with PVD sputtering technology.

The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board.



Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.


China AlN Chips Copper Sputtering Depostion System,  Aluminum Nitride Copper Direct Plating Machine supplier

AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine

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