Customized SiC Ceramic Suction Cups for Lithography Applications
Brand Name:ZMSH
Certification:rohs
Model Number:SiC Ceramic Suction Cups
Minimum Order Quantity:3
Delivery Time:2-4 weeks
Payment Terms:T/T
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Shanghai Shanghai China
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Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
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SiC Ceramic Suction Cups Abstract
Customized SiC Ceramic Suction Cups for Lithography Applications
As a core component of the wafer stage in lithography machines, the silicon carbide (SiC) SiC Ceramic Suction Cups provides an extremely stable and thermally insensitive reference platform for wafers, owing to its ultra-high flatness, high stiffness, and low coefficient of thermal expansion. This is critical for achieving nanometer-level motion accuracy and repeatable positioning. Its internal precision micro-channel structure enables uniform and stable adsorption of the wafer via vacuum negative pressure, avoiding damage or micro-deformation caused by traditional mechanical clamping. Simultaneously, the excellent thermal conductivity of silicon carbide facilitates rapid equilibration of the wafer surface temperature, reducing thermal gradient-induced deformation, thereby ensuring line width uniformity and overlay accuracy. Furthermore, the inherent properties of the SiC Ceramic Suction Cups—being dust-free, wear-resistant, and chemically inert—allow it to meet the stringent requirements of Class 100 and above cleanroom environments, significantly minimizing the risk of wafer defects caused by particle contamination
SiC Ceramic Suction Cups Data
Parameter Category | Parameter Name | Typical Value/Range |
Physical Properties | Density | 3.1 g/cm³ |
Elastic Modulus | 410 GPa | |
Bending Strength | 500 MPa | |
Thermal Properties | Coefficient of Thermal Expansion | 4.6×10⁻⁶/K |
Thermal Conductivity | 170 W/m·K | |
Maximum Operating Temperature | >1600°C | |
Surface Properties | Flatness | ≤ 0.5 μm |
Surface Roughness (Ra) | < 0.1 μm | |
Adsorption-Related | Pore Size (Porous Type) | 5 - 50 μm |
Electrical Properties | Resistivity | 10^6 Ω·cm |
SiC Ceramic Suction Cups Characteristic
1. Ultra-High Precision & Mirror Polishing:
- SiC ceramic suction cups achieve a flatness within 0.3–0.5 μm through precision grinding and polishing, with surfaces capable of mirror-level polishing (surface roughness Ra < 0.1 μm) .
2. Ultra-Lightweight Design:
- Through lightweight structural designs (e.g., hollow or honeycomb configurations), SiC ceramic suction cups significantly reduce mass while maintaining high stiffness .
3. Exceptional Wear Resistance & High Stiffness:
- Silicon carbide ceramic boasts extreme hardness (Mohs hardness 9.5, second only to diamond) and outstanding wear resistance, ensuring long service life. Coupled with high stiffness (elastic modulus up to 410 GPa), it effectively resists deformation, maintaining stability under high-speed motion and heavy loads.
4. Low Thermal Expansion:
- The SiC ceramic suction cups exhibits a low coefficient of thermal expansion (≈4.5–4.7×10⁻⁶/K), making it highly insensitive to temperature fluctuations and resistant to thermal deformation.
Application of SiC Ceramic Suction Cups in Lithography Machines
1.Ultra-High Precision Wafer Carrying and Positioning: Leveraging its exceptional flatness (achieving 0.3–0.5 μm), high stiffness, and low coefficient of thermal expansion, the SiC ceramic suction cups provides an extremely stable, flat, and thermally resilient reference platform for the wafer.
2. Vacuum Adsorption and Stable Clamping: Through its precise micro-channel structure, the SiC ceramic suction cup applies vacuum pressure to uniformly and securely adsorb the wafer, preventing any displacement or vibration during high-speed motion.
3. Thermal Management Stability: The high thermal conductivity of silicon carbide facilitates rapid equilibration of the wafer surface temperature, reducing thermal gradient-induced expansion differences, thereby effectively suppressing wafer thermal distortion.
4. Meeting Stringent Cleanroom Requirements: The SiC ceramic suction cups generates no particulate debris, is wear-resistant, has low outgassing, and resists chemical corrosion, enabling it to meet the operational demands of lithography machines in Class 100 or higher cleanroom environments.
Lithography machine worktable
ZMSH SiC Ceramic Custom Parts
Please feel free to contact us if you have any customization requirements.
SiC Ceramic Suction Cups FAQ
Q1: What are silicon carbide (SiC) ceramic suction cups primarily used for?
A1: They are critical for high-precision handling and transport of wafers and sensitive substrates in semiconductor manufacturing, photovoltaics, and precision optics, ensuring contamination-free and stable adsorption under extreme conditions (e.g., high temperature, high vacuum).
Q2: Why choose silicon carbide over other materials for suction cups?
A2: Silicon carbide offers exceptional hardness (Mohs 9.5), high thermal stability (resists temperatures >1600°C), low thermal expansion, and superior chemical inertness, making it ideal for applications demanding ultra-cleanliness, wear resistance, and dimensional stability under thermal stress.
Tags: #SiC Ceramic Suction Cups, #Customized, #Lithography Applications
Customized SiC Ceramic Suction Cups for Lithography Applications
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