Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing
Brand Name:ZMSH
Certification:rohs
Model Number:Diamond Wire Single/Multiple Wire Saw machine
Minimum Order Quantity:3
Delivery Time:3-6 months
Payment Terms:T/T
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Location:
Shanghai Shanghai China
Address:
Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
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within 13 hours
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Equipment introduction of diamond wire single/multiple wire saw machine
Diamond Wire Single/Multiple Wire Saw Machine For Semiconductor Wafer Processing
The diamond wire single/multi-wire dual-station cutting machine is a high-end precision equipment specifically developed for processing hard and brittle materials. Utilizing electroplated diamond wire technology and equipped with dual independent workstations, it enables flexible switching between single-wire precision processing and multi-wire batch production modes. The system integrates high-precision motion control, intelligent tension systems, and adaptive cooling technology, making it ideal for precision cutting applications involving semiconductor wafers, photovoltaic silicon wafers, and optical components.
Diamond wire single/multiple wire saw machine technical specifications
| Parameter | Specification |
| Project | Single/multiple wire saw |
| Maximum workpiece size | ø 320*430mm |
| Main roller coating diameter | ø 210*450mm (Five main rollers) |
| Wire running speed | 1000 (MIX) m/min |
| Diamond wire diameter | 0.2-0.37mm |
| Line storage capacity of supply wheel | 20(0.25mm) diamond wire diameter/km |
| Cutting thickness range | 1.5-80mm |
| Cutting accuracy | 0.01mm |
| Vertical lifting stroke of workstation | 350mm |
| Cutting method | The workbench swings upwards, but the position of the diamond wire remains unchanged |
| Cutting feed speed | 0.01-10mm/min |
| Water tank | 300L |
| Cutting fluid | Anti-rust high-efficiency cutting fluid |
| Swing angle | ±8° |
| Swing speed | 0.83°/s |
| Maximum cutting tension | 100N (Set minimum unit 0.1N) |
| Cutting depth | 430mm |
| Workstation | 2 |
| Power supply | Three-phase five-wire AC380V/50Hz |
| Total power of machine tool | ≤52kW |
| Main motor | 7.5*3kW |
| Wiring motor | 0.75*2kW |
| Workbench swing motor | 1.3*2kW |
| Tension control motor | 4.4*2kW |
| Wire release and collection motor | 5.5*2kW |
| External dimensions (excluding rocker arm box) | 2310*2660*2893mm |
| External dimensions (including rocker arm box) | 2310*2660*2893mm |
| Machine weight | 6000kg |
Working principle of diamond wire single/multiple wire saw machine
1. Cutting System:
- Diamond wire forms closed-loop motion driven by servo motors (adjustable 0.5-3m/s)
- Wire tension is monitored in real-time via high-precision sensors (adjustable 20-50N)
- Worktable utilizes linear motor drive with positioning accuracy of ±1μm
2. Dual-Station Coordination:
- Station A: Single-wire mode (minimum wire diameter 0.1mm) for high-precision processing
- Station B: Multi-wire mode (up to 200 wires) for mass production
- Both stations can operate synchronously with automated workpiece transfer via robotic arm
3. Control System:
- PLC+PC architecture supporting G-code programming
- Machine vision positioning system (5μm repeatability)
- Real-time monitoring of 20+ process parameters including cutting force and temperature
Core features of diamond wire single/multiple wire saw machine
1. High-Precision Processing Capability:
- Precision air-bearing spindle and linear motor drive system ensure sub-micron accuracy
- Adaptive tension control system maintains stable cutting process
- Specially designed cooling system effectively controls processing temperature
2. Flexible Production Modes:
- Single-station high-precision mode meets R&D and small-batch needs
- Multi-station parallel processing significantly improves production efficiency
- Quick-change functionality adapts to diverse production requirements
3. Intelligent Control System:
- Advanced HMI interface for user-friendly operation
- Real-time monitoring and automatic optimization of key parameters
- Remote diagnostics and maintenance capabilities
4. Robust and Durable Design:
- Critical components utilize high-strength wear-resistant materials
- Modular structure facilitates maintenance
- Comprehensive protection systems extend equipment lifespan
Typical applications of diamond wire single/multiple wire saw machine
1. Semiconductor Wafer Manufacturing:
- Precision cutting of SiC/GaN power device wafers for EV and 5G infrastructure
- High-quality processing of sapphire substrates for LED and consumer electronics
- MEMS sensor chip dicing ensuring device performance and reliability
2. Photovoltaic Production:
- High-efficiency slicing of large monocrystalline silicon ingots
- Precision processing of heterojunction solar cells
- Stable cutting of ultra-thin silicon wafers (<120μm)
3. Optical Component Processing:
- Precision forming of quartz glass optical elements
- Accurate cutting of laser crystals (YAG, sapphire, etc.)
- Infrared optical window processing
4. Special Material Processing:
- Precision machining of AlN/Al₂O₃ ceramic substrates
- Cutting of silicon carbide composites
- Processing of ultra-hard materials (CVD diamond)
5. Research & Special Applications:
- Prototyping of novel semiconductor materials
- Development of micro-devices and special structures
- Custom-shaped sample preparation
Technical advantages of diamond wire single/multiple wire saw machine
- Stable processing quality with >99.5% yield rate
- Adaptable to various hard/brittle materials
- Significantly higher productivity than conventional methods
- Easy operation and maintenance with low TCO
Note: Custom solutions available including special dimension processing and cleanroom versions.
FAQ of diamond wire single/multiple wire saw machine
1. Q: What is the main advantage of a dual-station diamond wire
saw?
A: It enables simultaneous high-precision single-wire cutting and
multi-wire batch processing, boosting productivity by 50% compared
to single-mode machines.
2. Q: Which materials can be cut with diamond wire dual-station
saws?
A: Hard/brittle materials like silicon, SiC, GaN, sapphire, quartz,
and ceramics with precision up to ±0.01mm.
Tags: #Diamond Wire Single/Multiple Wire Saw Machine, #Semiconductor Wafer Processing
Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing
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